发明授权
- 专利标题: Defect inspection method and apparatus therefor
- 专利标题(中): 缺陷检查方法及其设备
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申请号: US09733092申请日: 2000-12-11
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公开(公告)号: US06674890B2公开(公告)日: 2004-01-06
- 发明人: Shunji Maeda , Kenji Oka , Hiroshi Makihira , Yasuhiko Nakayama , Minoru Yoshida , Yukihiro Shibata , Chie Shishido
- 申请人: Shunji Maeda , Kenji Oka , Hiroshi Makihira , Yasuhiko Nakayama , Minoru Yoshida , Yukihiro Shibata , Chie Shishido
- 优先权: JP9-296649 19971029
- 主分类号: G06K900
- IPC分类号: G06K900
摘要:
A pattern inspection method and apparatus in which an image of a first pattern formed on a sample and an image of a second pattern formed on the sample is detected. At least one of the first pattern image and the second pattern image is converted to a gray level so as to be substantially the same with each other by linear combination including a gain and offset. A defect of the sample is detected by using the first pattern image and the second pattern image at least one of which has been converted to the gray level and a result of the detection is outputted to an external storage or processor by a communication arrangement.
公开/授权文献
- US20020031248A1 Defect inspection method and apparatus therefor 公开/授权日:2002-03-14
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