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    Defect inspection method and apparatus therefor
    2.
    发明授权
    Defect inspection method and apparatus therefor 有权
    缺陷检查方法及其设备

    公开(公告)号：US06169282A

    公开(公告)日：2001-01-02

    申请号：US09181851

    申请日：1998-10-29

    申请人： Shunji Maeda ,  Kenji Oka ,  Hiroshi Makihira ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Yukihiro Shibata ,  Chie Shishido

    发明人： Shunji Maeda ,  Kenji Oka ,  Hiroshi Makihira ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Yukihiro Shibata ,  Chie Shishido

    IPC分类号： H01J3728

    CPC分类号： G06T7/001 ,  G01R31/308 ,  G01R31/311 ,  G03F7/7065 ,  G06T7/0004 ,  G06T2207/10061 ,  G06T2207/30121 ,  G06T2207/30148

    摘要： A defect inspection method and apparatus therefor for a pattern to be inspected having a plurality of chips formed so as to be identical detect an image signal of a pattern to be inspected and when the image signal is to be compared with a detected image signal of an adjacent or separated pattern to be inspected on the substrate, convert the gray level so that the brightness of each of two image signals for comparing one or both of the detected image signals is almost identical in the local region by linear conversion having a gain and offset, and when a pattern is inspected using it, highly sensitive defect inspection for a pattern to be inspected for detecting a defect of a semiconductor wafer can be realized.

    摘要翻译： 对于要检查的图案的缺陷检查方法及其装置，其具有形成为相同的多个芯片，以检测待检查图案的图像信号，并且当图像信号要与检测到的图像信号进行比较时 要在基板上检查的相邻或分离的图案，转换灰度级，使得用于比较检测到的图像信号中的一个或两个的两个图像信号中的每一个的亮度在局部区域中通过具有增益和偏移的线性转换几乎相同 ，并且当使用它来检查图案时，可以实现用于检测半导体晶片的缺陷的待检查图案的高灵敏度缺陷检查。

    DEFECT INSPECTION METHOD AND APPARATUS
    3.
    发明申请
    DEFECT INSPECTION METHOD AND APPARATUS 审中-公开
    缺陷检查方法和装置

    公开(公告)号：US20120128230A1

    公开(公告)日：2012-05-24

    申请号：US13362151

    申请日：2012-01-31

    申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

    摘要： An inspection method, including: illuminating a light on a wafer on which plural chips having identical patterns are formed; imaging corresponding areas of two chips formed on the wafer to obtain inspection images and reference images with an image sensor; and processing the obtained inspection image and the reference image to produce a difference image which indicates a difference between the inspection image and the reference image and detect a defect by comparing the difference image with a threshold, wherein a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging peripheral portion of the wafer is different from a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging central portion of the wafer.

    摘要翻译： 一种检查方法，包括：在其上形成有多个具有相同图案的芯片的晶片上照射光; 对形成在晶片上的两个芯片的对应区域进行成像，以获得具有图像传感器的检查图像和参考图像; 并且处理所获得的检查图像和参考图像以产生指示检查图像和参考图像之间的差异的差异图像，并且通过将差异图像与阈值进行比较来检测缺陷，其中应用于差分图像的阈值是 通过比较检查图像和通过对晶片的周边部分进行成像获得的参考图像而产生的参考图像与通过比较检查图像和通过对晶片的中心部分进行成像而获得的参考图像而产生的差分图像的阈值不同。

    Defect inspection method and apparatus
    4.
    发明授权
    Defect inspection method and apparatus 有权
    缺陷检查方法和装置

    公开(公告)号：US07274813B2

    公开(公告)日：2007-09-25

    申请号：US11204181

    申请日：2005-08-16

    申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

    摘要： A method of inspecting defects of a plurality of patterns that are formed on a substrate to have naturally the same shape. According to this method, in order to detect very small defects of the patterns with high sensitivity without being affected by irregular brightness due to the thickness difference between the patterns formed on a semiconductor wafer, a first pattern being inspected is detected to produce a first image of the first pattern, the first image is stored, a second pattern being inspected is detected to produce a second image of said second pattern, the stored first image and the second image are matched in brightness, and the brightness-matched first and second images are compared with each other so that the patterns can be inspected.

    摘要翻译： 检查在基板上形成的具有自然相同形状的多个图案的缺陷的方法。 根据该方法，为了以高灵敏度检测图案的非常小的缺陷，不受由于在半导体晶片上形成的图案之间的厚度差而引起的不规则亮度的影响，检测出被检查的第一图案以产生第一图像 第一图案被存储，检测出被检查的第二图案以产生所述第二图案的第二图像，所存储的第一图像和第二图像的亮度相匹配，并且亮度匹配的第一和第二图像 彼此进行比较，从而可以检查图案。

    Defect inspection method and apparatus
    5.
    发明授权
    Defect inspection method and apparatus 有权
    缺陷检查方法和装置

    公开(公告)号：US08107717B2

    公开(公告)日：2012-01-31

    申请号：US13072102

    申请日：2011-03-25

    申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

    摘要： Arrangements for inspecting a specimen on which plural patterns are formed; capturing a first image of a first area; capturing a second image of a second area in which patterns which are essentially the same with the patterns formed in the first area; creating data relating to corresponding pixels of the first and second images, for each pixel; determining a threshold for each pixel for detecting defects directly in accordance with the first and second images; and detecting defects on the specimen by processing the first and second images by using the threshold for each pixel and information of a scattered diagram of brightness of the first and second images, wherein the threshold is determined by using information of brightness of a local region of at least one of the first and second images, with the local region including an aimed pixel and peripheral pixels of the aimed pixel.

    摘要翻译： 用于检查形成多个图案的样本的布置; 捕获第一区域的第一图像; 捕获与形成在第一区域中的图案基本上相同的图案的第二区域的第二图像; 为每个像素创建与第一和第二图像的相应像素有关的数据; 根据第一和第二图像确定用于检测缺陷的每个像素的阈值; 以及通过使用每个像素的阈值和第一和第二图像的亮度的散射图的信息来处理第一和第二图像来检测样本上的缺陷，其中，通过使用第一和第二图像的局部区域的亮度的信息来确定阈值 第一和第二图像中的至少一个，其中局部区域包括目标像素和目标像素的外围像素。

    Defect inspection method and apparatus
    7.
    发明申请
    Defect inspection method and apparatus 有权
    缺陷检查方法和装置

    公开(公告)号：US20060038987A1

    公开(公告)日：2006-02-23

    申请号：US11204181

    申请日：2005-08-16

    申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    IPC分类号： G01N21/88

    CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

    摘要： A method of inspecting defects of a plurality of patterns that are formed on a substrate to have naturally the same shape. According to this method, in order to detect very small defects of the patterns with high sensitivity without being affected by irregular brightness due to the thickness difference between the patterns formed on a semiconductor wafer, a first pattern being inspected is detected to produce a first image of the first pattern, the first image is stored, a second pattern being inspected is detected to produce a second image of said second pattern, the stored first image and the second image are matched in brightness, and the brightness-matched first and second images are compared with each other so that the patterns can be inspected.

    摘要翻译： 检查在基板上形成的具有自然相同形状的多个图案的缺陷的方法。 根据该方法，为了以高灵敏度检测图案的非常小的缺陷，不受由于在半导体晶片上形成的图案之间的厚度差而引起的不规则亮度的影响，检测出被检查的第一图案以产生第一图像 第一图案被存储，检测出被检查的第二图案以产生所述第二图案的第二图像，所存储的第一图像和第二图像的亮度相匹配，并且亮度匹配的第一和第二图像 彼此进行比较，从而可以检查图案。

    Defect inspection method and apparatus
    8.
    发明授权
    Defect inspection method and apparatus 有权
    缺陷检查方法和装置

    公开(公告)号：US07916929B2

    公开(公告)日：2011-03-29

    申请号：US12359452

    申请日：2009-01-26

    申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

    摘要： A method of inspecting patterns, including: adjusting a brightness of at least one of a first bright field image and a second bright field image detected from a specimen and directed to similar patterns on differing parts of the specimen, so as to more closely match a brightness; comparing the images which are adjusted in brightness to match with each other to detect dissimilarities indicative of a defect of the pattern, wherein in adjusting the brightness, the brightness between the first bright field image and the second bright field image is adjusted by performing a gradation conversion of at least one of the brightness between the first bright field image and the second bright field image; and wherein in the comparing, said defect of the pattern is detected by using information of a scattered diagram of brightness of the first bright field image and the second bright field image.

    摘要翻译： 一种检查图案的方法，包括：调整从样本检测到的第一明视野图像和第二亮视场图像中的至少一个的亮度，并且针对样本的不同部分上的相似图案，以便更紧密地匹配 亮度; 将亮度调整后的图像进行比较以相互匹配，以检测表示图案缺陷的不相似性，其中在调整亮度时，通过执行渐变来调整第一亮场图像和第二亮视场图像之间的亮度 第一亮场图像和第二亮场图像之间的亮度中的至少一个的转换; 并且其中在所述比较中，通过使用所述第一亮场图像和所述第二亮视场图像的亮度的散射图的信息来检测所述图案的所述缺陷。

    DEFECT INSPECTION METHOD AND APPARATUS
    9.
    发明申请
    DEFECT INSPECTION METHOD AND APPARATUS 有权
    缺陷检查方法和装置

    公开(公告)号：US20090214102A1

    公开(公告)日：2009-08-27

    申请号：US12359452

    申请日：2009-01-26

    申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

    摘要： A method of inspecting patterns, including: adjusting a brightness of at least one of a first bright field image and a second bright field image detected from a specimen and directed to similar patterns on differing parts of the specimen, so as to more closely match a brightness; comparing the images which are adjusted in brightness to match with each other to detect dissimilarities indicative of a defect of the pattern, wherein in adjusting the brightness, the brightness between the first bright field image and the second bright field image is adjusted by performing a gradation conversion of at least one of the brightness between the first bright field image and the second bright field image; and wherein in the comparing, said defect of the pattern is detected by using information of a scattered diagram of brightness of the first bright field image and the second bright field image.

    摘要翻译： 一种检查图案的方法，包括：调整从样本检测到的第一明视野图像和第二亮视场图像中的至少一个的亮度，并指示到样本的不同部分上的相似图案，以便更紧密地匹配 亮度; 将亮度调整后的图像进行比较以相互匹配，以检测表示图案缺陷的不相似性，其中在调整亮度时，通过执行渐变来调整第一亮场图像和第二亮视场图像之间的亮度 第一亮场图像和第二亮场图像之间的亮度中的至少一个的转换; 并且其中在所述比较中，通过使用所述第一亮场图像和所述第二亮视场图像的亮度的散射图的信息来检测所述图案的所述缺陷。