发明授权
- 专利标题： Bare chip mounting method and bare chip mounting system
- 专利标题（中）： 裸芯片安装方法和裸芯片安装系统
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申请号： US10267668申请日： 2002-10-10
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公开(公告)号： US06680221B2公开(公告)日： 2004-01-20
- 发明人: Tetsuya Tokunaga , Takahiro Yonezawa , Hiroyuki Kiyomura , Tatsuo Sasaoka , Satoshi Horie
- 申请人： Tetsuya Tokunaga , Takahiro Yonezawa , Hiroyuki Kiyomura , Tatsuo Sasaoka , Satoshi Horie
- 优先权： JP2001-314210 20011011
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.
公开/授权文献
- US20030096451A1 Bare chip mounting method and bare chip mounting system 公开/授权日：2003-05-22
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