公开(公告)号：US06680221B2

公开(公告)日：2004-01-20

申请号：US10267668

申请日：2002-10-10

申请人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka ,  Satoshi Horie

发明人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka ,  Satoshi Horie

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L21/6836 ,  H01L24/11 ,  H01L24/75 ,  H01L2221/68327 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.

摘要翻译： 裸芯片安装方法包括：切割步骤，用于在将半导体晶片附着到载体上的同时将半导体晶片分成单独的IC芯片; 用于洗涤切割的半导体晶片的洗涤步骤; 用于在将半导体晶片附着到载体上时将用于将洗涤的半导体晶片携带到组装过程的凸块接合，以在晶片的电极焊盘上形成凸块; 以及安装步骤，用于将形成有凸块的每个IC芯片安装到电路形成体上。

公开(公告)号：US06902101B2

公开(公告)日：2005-06-07

申请号：US10294614

申请日：2002-11-15

申请人： Satoshi Horie ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka

发明人： Satoshi Horie ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka

IPC分类号： B23K20/00 ,  H01L21/60 ,  H01L21/607 ,  B23K31/00 ,  B23K31/02 ,  B23K37/00

CPC分类号： B23K20/007 ,  H01L24/11 ,  H01L24/12 ,  H01L24/45 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/20308 ,  H01L2924/20309 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752

摘要： In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230±10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.

摘要翻译： 在用于在IC上形成凸块的凸块接合技术中，包括在从毛细管突出的金线的尖端处形成球，并且通过从超声波头通过毛细管施加超声波振动来提供金属对金属接头，同时 将球压在IC上的焊盘部分上，通过以130至320kHz的范围内，更优选在170至270kHz的范围内施加超声波振动来提供金属对金属接头，并且大多数 优选在室温和大气压下以230±10kHz的频率进行。 因此，在良好的接合状态下，在具有低耐热温度的IC上形成凸块，并且在没有给周围环境造成热的影响的情况下形成具有良好位置精度的凸块。

公开(公告)号：US06474538B1

公开(公告)日：2002-11-05

申请号：US09691247

申请日：2000-10-19

申请人： Takahiro Yonezawa ,  Akihiro Yamamoto ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka ,  Masahiko Hashimoto

发明人： Takahiro Yonezawa ,  Akihiro Yamamoto ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka ,  Masahiko Hashimoto

IPC分类号： B23K3102

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20759 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/00015

摘要： A higher speed moving device moves a capillary at high speed. A low inertial moving and pressing device moves and presses the capillary with low inertia. The high speed motion, and the moving and pressing motion with the low inertia are carried out independently of each other. Thus, an inertia at the low inertial moving and pressing device is reduced, whereby an impact force when a melt ball is driven by the low inertial moving and pressing device into contact with an electrode of a semiconductor integrated circuit is restricted, thus enabling stable formation for minute bumps. On the other hand, operations other than pressing the melt ball to the electrode and joining the melt ball are conducted by driving the capillary by the higher speed moving device, so that productivity is improved.

摘要翻译： 高速移动装置高速移动毛细管。 低惯性移动和挤压装置以低惯性运动并按压毛细管。 高速运动以及具有低惯量的移动和按压运动彼此独立地进行。 因此，在低惯性运动和加压装置处的惯性减小，由此熔融球被低惯性运动和加压装置驱动与半导体集成电路的电极接触的冲击力受到限制，从而能够稳定地形成 微小的颠簸。 另一方面，通过用高速移动装置驱动毛细管来进行将熔融球压入电极并接合熔融球的操作，从而提高生产率。

公开(公告)号：US06712111B2

公开(公告)日：2004-03-30

申请号：US10094773

申请日：2002-03-11

申请人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka

发明人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka

IPC分类号： B23B3100

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T156/12 ,  H01L2224/48 ,  H01L2924/00

摘要： A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded by the protective ring, is carried from a container device to a bonding stage. Bonding is performed on the bonding stage, and the wafer is carried out to another container device, consequently damage of the wafer is avoided.

摘要翻译： 使用具有在环的下侧延伸的片材的保护环的载体工具，使半导体晶片粘附到片材上，被保护环包围的半导体晶片从容器装置承载到 粘结阶段。 在接合台上进行接合，并且将晶片进行到另一容器装置，从而避免了晶片的损坏。

公开(公告)号：US06667250B2

公开(公告)日：2003-12-23

申请号：US10403081

申请日：2003-04-01

申请人： Tatsuo Sasaoka ,  Naoki Suzuki ,  Takahiro Yonezawa ,  Satoshi Horie

发明人： Tatsuo Sasaoka ,  Naoki Suzuki ,  Takahiro Yonezawa ,  Satoshi Horie

IPC分类号： H01L2131

CPC分类号： H01L21/6838 ,  H01L21/6831 ,  H05K3/3489 ,  H05K3/381 ,  Y10S414/135 ,  Y10S414/139

摘要： To provide a film substrate treatment apparatus that appropriately mounts film substrates on an electrostatic adsorption stage. In the film substrate treatment apparatus, adsorption pads are disposed on the first adsorption units that mount film substrates on an electrostatic stage, and a pressing member that presses the edge portion areas of the film substrates against the stage is provided. The film substrates can thereby be reliably attached to the stage, and the film substrates can be appropriately treated in a decompressed atmosphere.

摘要翻译： 提供一种适当地将薄膜基板安装在静电吸附台上的薄膜基板处理装置。 在薄膜基板处理装置中，设置吸附垫，将第一吸附单元安装在静电台上的薄膜基板上，并且提供将薄膜基板的边缘部分区域压在台上的按压构件。 因此，能够将膜基材可靠地附着在载物台上，并且可以在减压气氛中适当地处理膜基材。

公开(公告)号：US20070193682A1

公开(公告)日：2007-08-23

申请号：US10599638

申请日：2005-04-06

申请人： Tatsuo Sasaoka ,  Satoshi Horie ,  Isamu Aokura ,  Yoshihiko Yagi ,  Kazuki Fukada

发明人： Tatsuo Sasaoka ,  Satoshi Horie ,  Isamu Aokura ,  Yoshihiko Yagi ,  Kazuki Fukada

IPC分类号： B32B38/16 ,  B32B38/10 ,  B32B38/00 ,  B31F1/07

CPC分类号： B23K1/203 ,  B23K2101/40 ,  H01L21/4864 ,  H01L21/6835 ,  H01L23/3142 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1181 ,  H01L2224/1184 ,  H01L2224/13019 ,  H01L2224/13144 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75753 ,  H01L2224/81009 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81013 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2224/8182 ,  H01L2224/81894 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K3/328 ,  H05K3/3489 ,  H05K3/383 ,  H05K2201/0373 ,  H05K2201/10674 ,  H05K2203/0307 ,  Y10S438/974 ,  Y10T156/1023 ,  Y10T156/14 ,  H01L2224/05599

摘要： A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects (1b, 2a) to be bonded together are cleaned in an initial cleaning step (S1) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one (1b) of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S3); a surface treatment step (S5) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces (1b, 2a) again; and the uneven bonding surface (1b) is pressed against the other bonding surface (2a) to bond them together.

摘要翻译： 在大气压和室温下能够进行金属接合的接合方法和装置，其中在初始清洁步骤（S1）中清洁要结合在一起的物体（1b，2a）的表面以除去结合抑制剂 物质（G），如氧化物和附着物质; 一个（1b）的粘合表面在表面粗糙度控制步骤（S 3）中设置有具有预定粗糙度的凹凸轮廓; 执行表面处理步骤（S 5）以除去已经去除但又粘附到接合表面（1b，2a）上的物质（F） 并且不平坦的接合表面（1b）被压靠在另一个接合表面（2a）上以将它们结合在一起。

公开(公告)号：US20060081974A1

公开(公告)日：2006-04-20

申请号：US11288020

申请日：2005-11-28

申请人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Satoshi Horie ,  Takashi Omura

发明人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Satoshi Horie ,  Takashi Omura

IPC分类号： H01L23/48

CPC分类号： H05K13/04 ,  H01L21/67739 ,  H01L24/75 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/26 ,  H05K3/3489 ,  Y10T29/5136 ,  Y10T29/5137 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00

摘要： An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, amounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

摘要翻译： 电子部件安装装置包括用于清洁基板的室和通过等离子体的电子部件，用于将电子部件安装在电子部件上的分配机构，以及用于将基板和电子部件从腔室传送到安装机构的输送机器人 。 等离子体清洁后，基板和电子部件通过输送机器人迅速地传送到安装机构。 在通过安装机构将电子部件安装在基板上之后，将它们的组合进行脉冲加热。 因此，电子部件以暴露于空气的状态适当地安装在基板上。 零件安装机构简化。

公开(公告)号：US07659148B2

公开(公告)日：2010-02-09

申请号：US10599638

申请日：2005-04-06

申请人： Tatsuo Sasaoka ,  Satoshi Horie ,  Isamu Aokura ,  Yoshihiko Yagi ,  Kazuki Fukada

发明人： Tatsuo Sasaoka ,  Satoshi Horie ,  Isamu Aokura ,  Yoshihiko Yagi ,  Kazuki Fukada

IPC分类号： H01L21/60 ,  H01L21/603 ,  H05K3/32 ,  H01L21/58

CPC分类号： B23K1/203 ,  B23K2101/40 ,  H01L21/4864 ,  H01L21/6835 ,  H01L23/3142 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1181 ,  H01L2224/1184 ,  H01L2224/13019 ,  H01L2224/13144 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75753 ,  H01L2224/81009 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81013 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2224/8182 ,  H01L2224/81894 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K3/328 ,  H05K3/3489 ,  H05K3/383 ,  H05K2201/0373 ,  H05K2201/10674 ,  H05K2203/0307 ,  Y10S438/974 ,  Y10T156/1023 ,  Y10T156/14 ,  H01L2224/05599

摘要： A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects (1b, 2a) to be bonded together are cleaned in an initial cleaning step (S1) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one (1b) of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S3); a surface treatment step (S5) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces (1b, 2a) again; and the uneven bonding surface (1b) is pressed against the other bonding surface (2a) to bond them together.

摘要翻译： 在大气压和室温下能够进行金属接合的接合方法和装置，其中在初始清洁步骤（S1）中清洁要结合在一起的物体（1b，2a）的表面以除去粘合抑制剂物质（G ）如氧化物和附着物质; 一个（1b）的接合表面在表面粗糙度控制步骤（S3）中设置有具有预定粗糙度的不平坦轮廓; 执行表面处理步骤（S5）以除去已经去除但再次粘合到接合表面（1b，2a）上的物质（F）; 并且不平坦的接合表面（1b）被压靠在另一个接合表面（2a）上以将它们结合在一起。

公开(公告)号：US06996889B2

公开(公告)日：2006-02-14

申请号：US10627479

申请日：2003-07-25

申请人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Satoshi Horie ,  Takashi Omura

发明人： Kazushi Higashi ,  Tatsuo Sasaoka ,  Satoshi Horie ,  Takashi Omura

IPC分类号： B23P23/00

CPC分类号： H05K13/04 ,  H01L21/67739 ,  H01L24/75 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/26 ,  H05K3/3489 ,  Y10T29/5136 ,  Y10T29/5137 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00

摘要： An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

摘要翻译： 电子部件安装装置包括用于通过等离子体清洁基板和电子部件的室，用于将电子部件安装在电子部件上的安装机构，以及用于将基板和电子部件从腔室输送到安装件的输送机器人 机制。 等离子体清洁后，基板和电子部件通过输送机器人迅速地传送到安装机构。 在通过安装机构将电子部件安装在基板上之后，将它们的组合进行脉冲加热。 因此，电子部件以暴露于空气的状态适当地安装在基板上。 零件安装机构简化。

公开(公告)号：US09246073B2

公开(公告)日：2016-01-26

申请号：US13000784

申请日：2009-06-18

申请人： Tatsuo Sasaoka ,  Kaori Toyoda ,  Kentaro Nishiwaki ,  Hiroki Ikeuchi ,  Hiroshi Nasu

发明人： Tatsuo Sasaoka ,  Kaori Toyoda ,  Kentaro Nishiwaki ,  Hiroki Ikeuchi ,  Hiroshi Nasu

IPC分类号： B23K31/02 ,  H01L33/62 ,  B23K35/02 ,  B23K1/00 ,  H01L23/00 ,  H01L33/64 ,  H05K3/32 ,  H01L21/56 ,  H01L31/024 ,  H05K3/40

CPC分类号： H01L33/62 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L31/024 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/29076 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83207 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/2036 ,  H05K2203/1131 ,  H05K2203/1178 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01014 ,  H01L2224/29298 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00014

摘要： A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21a of the electronic component 3 and is used as a spacer.

摘要翻译： 提供一种安装结构，其可以允许当执行热处理时产生的气体有效地逸出到外部。 安装结构10包括具有电极2a和2b的基板1，具有电极21a和21b的电子部件3，将基板1的电极2a和2b与电子部件的电极21a和21b电连接的接头15a和15b 并且还将电子部件3固定到基板1的表面，以及与基板1的电极2a和电子部件3的电极21a抵接并用作间隔件的凸部4。