公开(公告)号：US06680221B2

公开(公告)日：2004-01-20

申请号：US10267668

申请日：2002-10-10

申请人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka ,  Satoshi Horie

发明人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka ,  Satoshi Horie

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L21/6836 ,  H01L24/11 ,  H01L24/75 ,  H01L2221/68327 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.

摘要翻译： 裸芯片安装方法包括：切割步骤，用于在将半导体晶片附着到载体上的同时将半导体晶片分成单独的IC芯片; 用于洗涤切割的半导体晶片的洗涤步骤; 用于在将半导体晶片附着到载体上时将用于将洗涤的半导体晶片携带到组装过程的凸块接合，以在晶片的电极焊盘上形成凸块; 以及安装步骤，用于将形成有凸块的每个IC芯片安装到电路形成体上。

公开(公告)号：US06902101B2

公开(公告)日：2005-06-07

申请号：US10294614

申请日：2002-11-15

申请人： Satoshi Horie ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka

发明人： Satoshi Horie ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka

IPC分类号： B23K20/00 ,  H01L21/60 ,  H01L21/607 ,  B23K31/00 ,  B23K31/02 ,  B23K37/00

CPC分类号： B23K20/007 ,  H01L24/11 ,  H01L24/12 ,  H01L24/45 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/20308 ,  H01L2924/20309 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752

摘要： In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230±10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.

摘要翻译： 在用于在IC上形成凸块的凸块接合技术中，包括在从毛细管突出的金线的尖端处形成球，并且通过从超声波头通过毛细管施加超声波振动来提供金属对金属接头，同时 将球压在IC上的焊盘部分上，通过以130至320kHz的范围内，更优选在170至270kHz的范围内施加超声波振动来提供金属对金属接头，并且大多数 优选在室温和大气压下以230±10kHz的频率进行。 因此，在良好的接合状态下，在具有低耐热温度的IC上形成凸块，并且在没有给周围环境造成热的影响的情况下形成具有良好位置精度的凸块。

公开(公告)号：US06474538B1

公开(公告)日：2002-11-05

申请号：US09691247

申请日：2000-10-19

申请人： Takahiro Yonezawa ,  Akihiro Yamamoto ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka ,  Masahiko Hashimoto

发明人： Takahiro Yonezawa ,  Akihiro Yamamoto ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka ,  Masahiko Hashimoto

IPC分类号： B23K3102

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20759 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/00015

摘要： A higher speed moving device moves a capillary at high speed. A low inertial moving and pressing device moves and presses the capillary with low inertia. The high speed motion, and the moving and pressing motion with the low inertia are carried out independently of each other. Thus, an inertia at the low inertial moving and pressing device is reduced, whereby an impact force when a melt ball is driven by the low inertial moving and pressing device into contact with an electrode of a semiconductor integrated circuit is restricted, thus enabling stable formation for minute bumps. On the other hand, operations other than pressing the melt ball to the electrode and joining the melt ball are conducted by driving the capillary by the higher speed moving device, so that productivity is improved.

摘要翻译： 高速移动装置高速移动毛细管。 低惯性移动和挤压装置以低惯性运动并按压毛细管。 高速运动以及具有低惯量的移动和按压运动彼此独立地进行。 因此，在低惯性运动和加压装置处的惯性减小，由此熔融球被低惯性运动和加压装置驱动与半导体集成电路的电极接触的冲击力受到限制，从而能够稳定地形成 微小的颠簸。 另一方面，通过用高速移动装置驱动毛细管来进行将熔融球压入电极并接合熔融球的操作，从而提高生产率。

公开(公告)号：US06712111B2

公开(公告)日：2004-03-30

申请号：US10094773

申请日：2002-03-11

申请人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka

发明人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka

IPC分类号： B23B3100

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T156/12 ,  H01L2224/48 ,  H01L2924/00

摘要： A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded by the protective ring, is carried from a container device to a bonding stage. Bonding is performed on the bonding stage, and the wafer is carried out to another container device, consequently damage of the wafer is avoided.

摘要翻译： 使用具有在环的下侧延伸的片材的保护环的载体工具，使半导体晶片粘附到片材上，被保护环包围的半导体晶片从容器装置承载到 粘结阶段。 在接合台上进行接合，并且将晶片进行到另一容器装置，从而避免了晶片的损坏。

公开(公告)号：US06667250B2

公开(公告)日：2003-12-23

申请号：US10403081

申请日：2003-04-01

申请人： Tatsuo Sasaoka ,  Naoki Suzuki ,  Takahiro Yonezawa ,  Satoshi Horie

发明人： Tatsuo Sasaoka ,  Naoki Suzuki ,  Takahiro Yonezawa ,  Satoshi Horie

IPC分类号： H01L2131

CPC分类号： H01L21/6838 ,  H01L21/6831 ,  H05K3/3489 ,  H05K3/381 ,  Y10S414/135 ,  Y10S414/139

摘要： To provide a film substrate treatment apparatus that appropriately mounts film substrates on an electrostatic adsorption stage. In the film substrate treatment apparatus, adsorption pads are disposed on the first adsorption units that mount film substrates on an electrostatic stage, and a pressing member that presses the edge portion areas of the film substrates against the stage is provided. The film substrates can thereby be reliably attached to the stage, and the film substrates can be appropriately treated in a decompressed atmosphere.

摘要翻译： 提供一种适当地将薄膜基板安装在静电吸附台上的薄膜基板处理装置。 在薄膜基板处理装置中，设置吸附垫，将第一吸附单元安装在静电台上的薄膜基板上，并且提供将薄膜基板的边缘部分区域压在台上的按压构件。 因此，能够将膜基材可靠地附着在载物台上，并且可以在减压气氛中适当地处理膜基材。

公开(公告)号：US07246430B2

公开(公告)日：2007-07-24

申请号：US10857940

申请日：2004-06-02

申请人： Takahiro Yonezawa ,  Ken Kobayashi ,  Mikio Hasegawa ,  Hiroshi Nasu ,  Makoto Imanishi ,  Katsuhiko Watanabe

发明人： Takahiro Yonezawa ,  Ken Kobayashi ,  Mikio Hasegawa ,  Hiroshi Nasu ,  Makoto Imanishi ,  Katsuhiko Watanabe

IPC分类号： B23P19/00

CPC分类号： H05K13/0413 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K13/082 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191 ,  H01L2924/00

摘要： In an electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that has piezoelectric elements provided in a stack in a mounting direction of the electronic component. Therefore, a size in a horizontal direction of the load sensor can be reduced, and a load applied to the electronic component can be detected at a neighborhood of a mounting position of the electronic component. Moreover, by comparing a position, in a two-dimensional space in which load values in an X-direction and Y-direction of the horizontal load serve as coordinate values, with a tolerance range in the two-dimensional space, a mounting failure can be detected from a deviation in the horizontal loads.

摘要翻译： 在电子部件安装装置中，通过负载传感器检测施加到电子部件的垂直负载和水平负载，所述负载传感器具有沿电子部件的安装方向设置在堆叠中的压电元件。 因此，可以减小负载传感器的水平方向的尺寸，并且能够在电子部件的安装位置附近检测施加于电子部件的负荷。 此外，通过将二维空间中的水平载荷的X方向和Y方向的负荷值作为坐标值的二维空间与二维空间中的公差范围进行比较，可以将安装失败 从水平载荷的偏差中检测。

公开(公告)号：US06207549B1

公开(公告)日：2001-03-27

申请号：US08940981

申请日：1997-09-30

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L2144

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US6017812A

公开(公告)日：2000-01-25

申请号：US119974

申请日：1998-07-21

申请人： Takahiro Yonezawa ,  Osamu Nakao ,  Shinji Kanayama ,  Akihiro Yamamoto ,  Makoto Imanishi ,  Koichi Yoshida

发明人： Takahiro Yonezawa ,  Osamu Nakao ,  Shinji Kanayama ,  Akihiro Yamamoto ,  Makoto Imanishi ,  Koichi Yoshida

IPC分类号： H01L21/60 ,  H01L21/607 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

摘要： The present invention provides a bump bonding method that can prevent bumps from being inappropriately shaped. The bump bonding method comprises forming a gold ball (16) at the tip of a gold wire (1) that is inserted through a capillary (3), lowering the capillary (3) while using a displacement detection sensor to detect the vertical displacement of the capillary (3), detecting the position of that portion of an IC (11) in which an electrode is formed, based on the displacement of the capillary (3) detected by the displacement detection sensor when the gold ball (16) abuts the IC (11), pressing he gold ball (16) against the electrode forming portion to form a bump pedestal (17), elevating the capillary (3) a specified amount while moving it in the horizontal direction a specified amount, setting the height S of a position at which the capillary (3) is stopped based on the height H1 of the bump pedestal (17) detected by the displacement detection sensor, again lowering the capillary (3) down to the stop position height S to join the gold wire (1) to the bump pedestal (17), and then lifting the gold wire (1) to break the joint between the bump pedestal (17) and the gold wire (1).

摘要翻译： 本发明提供一种能够防止凸块不适当地形成的凸块接合方法。 凸点接合方法包括在金线（1）的尖端处形成金球（16），该金球插入通过毛细管（3），同时使用位移检测传感器来降低毛细管（3），以检测垂直位移 所述毛细管（3）基于当所述金球（16）邻接所述位置检测传感器时检测到的所述毛细管（3）的位移，检测形成有电极的所述IC（11）的所述部分的位置 IC（11），将金球（16）压在电极形成部分上以形成凸起基座（17），在毛细管（3）沿水平方向移动一定量的同时将毛细管（3）提高一定量，将高度S 基于由位移检测传感器检测到的凸起基座（17）的高度H1停止毛细管（3）的位置，再次将毛细管（3）降低到停止位置高度S，从而将金线 （1）到凸台（17），然后抬起g 旧电线（1），以破坏凸块基座（17）和金线（1）之间的接合部。

公开(公告)号：US5899140A

公开(公告)日：1999-05-04

申请号：US985204

申请日：1997-12-04

申请人： Akihiro Yamamoto ,  Makoto Imanishi ,  Takahiro Yonezawa ,  Shinzo Eguchi ,  Osamu Nakao

发明人： Akihiro Yamamoto ,  Makoto Imanishi ,  Takahiro Yonezawa ,  Shinzo Eguchi ,  Osamu Nakao

IPC分类号： H01L21/60 ,  H01L21/00 ,  B30B15/14

CPC分类号： H01L21/67092

摘要： A bump leveling method and a bump leveling apparatus in which the leveled height of bumps can be made constant and meet the change in thickness of an IC chip. A pressing force under which one bump is deformed to a prescribed height is measured. Thus, the pressing force under which a plurality of bumps can be deformed and leveled can be set. A load cell detects that a prescribed pressing force is exerted on the bumps and this pressing force is maintained, so that the plurality of bumps can be leveled up to the same prescribed height.

摘要翻译： 可以使凸块的调平高度恒定并满足IC芯片的厚度变化的凸块调平方法和凸块调平装置。 测量一个凸块变形到规定高度的压力。 因此，可以设定多个凸块能够变形和平整的按压力。 称重传感器检测到凸起上施加了规定的按压力，并且保持该按压力，使得多个凸块能够达到相同的规定高度。

公开(公告)号：US5686353A

公开(公告)日：1997-11-11

申请号：US576160

申请日：1995-12-21

申请人： Yoshihiko Yagi ,  Kazushi Higashi ,  Norihito Tsukahara ,  Koichi Kumagai ,  Takahiro Yonezawa

发明人： Yoshihiko Yagi ,  Kazushi Higashi ,  Norihito Tsukahara ,  Koichi Kumagai ,  Takahiro Yonezawa

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14

摘要： An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.

摘要翻译： 设置在半导体芯片（4）的表面上的电极端子（5）在平面图中具有正方形形状。 此外，设置在电极端子（5）上的突起（8）的突出顶部（8a）定向到电极端子（5）的角部（5a）。 因此，通过熔化通过毛细管（1）供给的金线（2）的下端部形成的金球（2a）与电极端子（5）接合，然后将毛细管（1）移动到 方形电极（5）的对角线方向。 因此，金线（2）的主要部分与金球（2a）分离，从而形成凸块（8）。