- 专利标题： BOC BGA package for die with I-shaped bond pad layout
-
申请号： US10068165申请日： 2002-02-05
-
公开(公告)号： US06692987B2公开(公告)日： 2004-02-17
- 发明人: Thiam Chye Lim , Kay Kit Tan , Kian Chai Lee , Victor Cher Khng Tan , Kwang Hong Tan , Chong Pei Andrew Lim , Yong Kian Tan , Teck Kheng Lee , Sian Yong Khoo , Yoke Kuin Tang
- 申请人： Thiam Chye Lim , Kay Kit Tan , Kian Chai Lee , Victor Cher Khng Tan , Kwang Hong Tan , Chong Pei Andrew Lim , Yong Kian Tan , Teck Kheng Lee , Sian Yong Khoo , Yoke Kuin Tang
- 优先权： SG2001-07789-0 20011212; SG2002-00134-5 20020109
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
公开/授权文献
- US20030148557A1 BOC BGA package for die with I-shaped bond pad layout 公开/授权日：2003-08-07