-
公开(公告)号:US08373277B2
公开(公告)日:2013-02-12
申请号:US12020738
申请日:2008-01-28
申请人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
IPC分类号: H01L23/12
CPC分类号: H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
-
公开(公告)号:US07282392B2
公开(公告)日:2007-10-16
申请号:US11511956
申请日:2006-08-29
申请人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
CPC分类号: H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
-
公开(公告)号:US07575953B2
公开(公告)日:2009-08-18
申请号:US11959013
申请日:2007-12-18
申请人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
CPC分类号: H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
摘要翻译: 提供半导体器件和堆叠管芯组件,以及制造用于增加半导体器件密度的器件和组件的方法。
-
公开(公告)号:US20080136045A1
公开(公告)日:2008-06-12
申请号:US12020738
申请日:2008-01-28
申请人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
CPC分类号: H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
-
公开(公告)号:US07332820B2
公开(公告)日:2008-02-19
申请号:US10424426
申请日:2003-04-28
申请人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
IPC分类号: H01L23/48
CPC分类号: H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要: Semiconductor devices and stacked die assemblies, and methods of fabrication are provided. In various embodiments, the die assembly comprises a first die mounted on a substrate and a second die mounted on the first die. In one embodiment, the second die has a recessed edge along the perimeter of the bottom surface to provide clearance for a bonding element extending from bond pads on the first die to pads on the substrate, thus eliminating the need for a spacer between the two dies. In another embodiment, the second die is at least partially disposed within a recess in the upper surface of the first die. In another embodiment, an adhesive element is disposed within a recess in the bottom surface of the first die for attaching the first die to the substrate. In yet another embodiment, the first die is at least partially disposed within a recess within the bottom surface of the second die. The stacked die assemblies can be encapsulated to form semiconductor packages.
摘要翻译: 提供半导体器件和堆叠管芯组件以及制造方法。 在各种实施例中,模具组件包括安装在基板上的第一模具和安装在第一模具上的第二模具。 在一个实施例中,第二管芯具有沿着底表面的周边的凹入边缘,以为从第一管芯上的焊盘延伸到衬底上的焊盘的接合元件提供间隙,从而消除了对两个管芯之间的间隔件的需要 。 在另一个实施例中,第二管芯至少部分地设置在第一管芯的上表面的凹部内。 在另一个实施例中,粘合元件设置在第一管芯的底表面的凹槽内,用于将第一管芯附接到基底。 在另一个实施例中,第一管芯至少部分地设置在第二管芯的底表面内的凹槽内。 堆叠的管芯组件可以被封装以形成半导体封装。
-
公开(公告)号:US07112048B2
公开(公告)日:2006-09-26
申请号:US10408990
申请日:2003-04-08
申请人: Thiam Chye Lim , Kay Kit Tan , Kian Chai Lee , Victor Cher Khng Tan , Kwang Hong Tan , Chong Pei Andrew Lim , Yong Kian Tan , Teck Kheng Lee , Sian Yong Khoo , Yoke Kuin Tang
发明人: Thiam Chye Lim , Kay Kit Tan , Kian Chai Lee , Victor Cher Khng Tan , Kwang Hong Tan , Chong Pei Andrew Lim , Yong Kian Tan , Teck Kheng Lee , Sian Yong Khoo , Yoke Kuin Tang
CPC分类号: H01L21/565 , H01L23/3128 , H01L23/50 , H01L24/02 , H01L24/06 , H01L24/48 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/06136 , H01L2224/32225 , H01L2224/45099 , H01L2224/4824 , H01L2224/73215 , H01L2224/85424 , H01L2224/8547 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
-
7.Method of fabricating a stacked die having a recess in a die BGA package 有权
标题翻译: 在模具BGA封装中制造具有凹部的堆叠模具的方法公开(公告)号:US07371608B2
公开(公告)日:2008-05-13
申请号:US10389433
申请日:2003-03-14
申请人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
CPC分类号: H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
摘要翻译: 提供半导体器件和堆叠管芯组件,以及制造用于增加半导体器件密度的器件和组件的方法。
-
公开(公告)号:US06720666B2
公开(公告)日:2004-04-13
申请号:US10408972
申请日:2003-04-08
申请人: Thiam Chye Lim , Kay Kit Tan , Kian Chai Lee , Victor Cher Khng Tan , Kwang Hong Tan , Chong Pei Andrew Lim , Yong Kian Tan , Teck Kheng Lee , Sian Yong Khoo , Yoke Kuin Tang
发明人: Thiam Chye Lim , Kay Kit Tan , Kian Chai Lee , Victor Cher Khng Tan , Kwang Hong Tan , Chong Pei Andrew Lim , Yong Kian Tan , Teck Kheng Lee , Sian Yong Khoo , Yoke Kuin Tang
IPC分类号: H01L2348
CPC分类号: H01L21/565 , H01L23/3128 , H01L23/50 , H01L24/02 , H01L24/06 , H01L24/48 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/06136 , H01L2224/32225 , H01L2224/45099 , H01L2224/4824 , H01L2224/73215 , H01L2224/85424 , H01L2224/8547 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
摘要翻译: 提供用于形成BOC BGA封装的半导体管芯单元,封装半导体管芯单元的方法,用于该方法的模具以及所得到的封装封装。 特别地,本发明提供了一种半导体管芯单元,其包括具有I形布置的多个接合焊盘的集成电路管芯和具有I形引线接合槽的上覆的支撑衬底。
-
公开(公告)号:US07358117B2
公开(公告)日:2008-04-15
申请号:US11511941
申请日:2006-08-29
申请人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
IPC分类号: H01L21/44
CPC分类号: H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
摘要翻译: 提供半导体器件和堆叠管芯组件,以及制造用于增加半导体器件密度的器件和组件的方法。
-
公开(公告)号:US07344969B2
公开(公告)日:2008-03-18
申请号:US10424470
申请日:2003-04-28
申请人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
发明人: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
IPC分类号: H01L23/48
CPC分类号: H01L25/074 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/05599 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83855 , H01L2224/8388 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/10158 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207
摘要: Semiconductor devices and stacked die assemblies, and methods of fabrication are provided. In various embodiments, the die assembly comprises a first die mounted on a substrate and a second die mounted on the first die. In one embodiment, the second die has a recessed edge along the perimeter of the bottom surface to provide clearance for a bonding element extending from bond pads on the first die to pads on the substrate, thus eliminating the need for a spacer between the two dies. In another embodiment, the second die is at least partially disposed within a recess in the upper surface of the first die. In another embodiment, an adhesive element is disposed within a recess in the bottom surface of the first die for attaching the first die to the substrate. In yet another embodiment, the first die is at least partially disposed within a recess within the bottom surface of the second die. The stacked die assemblies can be encapsulated to form semiconductor packages.
-
-
-
-
-
-
-
-
-