发明授权
- 专利标题: Electrical coupling of a stiffener to a chip carrier
- 专利标题(中): 加强筋与芯片载体的电耦合
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申请号: US10305643申请日: 2002-11-26
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公开(公告)号: US06699736B2公开(公告)日: 2004-03-02
- 发明人: Terry J. Dornbos , Raymond A. Phillips, Jr. , Mark V. Pierson , William J. Rudik , David L. Thomas
- 申请人: Terry J. Dornbos , Raymond A. Phillips, Jr. , Mark V. Pierson , William J. Rudik , David L. Thomas
- 主分类号: H01L2144
- IPC分类号: H01L2144
摘要:
A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.
公开/授权文献
- US20030082853A1 Electrical coupling of a stiffener to a chip carrier 公开/授权日:2003-05-01