公开(公告)号：US06699736B2

公开(公告)日：2004-03-02

申请号：US10305643

申请日：2002-11-26

申请人： Terry J. Dornbos ,  Raymond A. Phillips, Jr. ,  Mark V. Pierson ,  William J. Rudik ,  David L. Thomas

发明人： Terry J. Dornbos ,  Raymond A. Phillips, Jr. ,  Mark V. Pierson ,  William J. Rudik ,  David L. Thomas

IPC分类号： H01L2144

CPC分类号： H05K3/0061 ,  H01L21/4846 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10977

摘要： A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.

摘要翻译： 用于将金属加强件导电耦合到芯片载体的方法和结构。 衬底在其表面上具有导电焊盘，并且在衬底表面上形成粘合剂层。 金属加强件被放置在粘合剂层上，其中粘合剂层将加强件机械地连接到基底表面，并将加强件电耦合到垫。 然后将粘合剂层固化，例如通过在升高的温度下加压。 本发明的实施例通过在焊盘上形成导电触点并在基板上设置干燥的粘合剂来形成粘合剂层，使得导电触点位于干粘合剂中的孔内。 导电触头将加强件电耦合到焊盘。 固化步骤包括固化干燥粘合剂和导电接触，导致干燥粘合剂将加强剂粘合到基底上。 导电接触可包括导电粘合剂或金属焊料。 本发明的另外的实施方案通过在基底上施加导电粘合剂形成粘合剂层，其中在将加强件放置在粘合剂层上之后，导电粘合剂将加强件机械地和电耦合到基底的表面。

公开(公告)号：US06534848B1

公开(公告)日：2003-03-18

申请号：US09657194

申请日：2000-09-07

申请人： Terry J. Dornbos ,  Raymond A. Phillips, Jr. ,  Mark V. Pierson ,  William J. Rudik ,  David L. Thomas

发明人： Terry J. Dornbos ,  Raymond A. Phillips, Jr. ,  Mark V. Pierson ,  William J. Rudik ,  David L. Thomas

IPC分类号： H01L2302

CPC分类号： H05K3/0061 ,  H01L21/4846 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10977

摘要： A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.