发明授权
- 专利标题： Solid conductive element insertion apparatus
- 专利标题（中）： 固体导电元件插入装置
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申请号： US10102129申请日： 2002-03-20
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公开(公告)号： US06712261B2公开(公告)日： 2004-03-30
- 发明人: Richard R. Hall , How T. Lin , Christopher J. Majka , Matthew F. Seward , Ronald V. Smith
- 申请人： Richard R. Hall , How T. Lin , Christopher J. Majka , Matthew F. Seward , Ronald V. Smith
- 主分类号： B23K3102
- IPC分类号： B23K3102
摘要：
An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.
公开/授权文献
- US20030178471A1 Solid conductive element insertion apparatus 公开/授权日：2003-09-25
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