Invention Grant
- Patent Title: Solid conductive element insertion apparatus
- Patent Title (中): 固体导电元件插入装置
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Application No.: US10102129Application Date: 2002-03-20
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Publication No.: US06712261B2Publication Date: 2004-03-30
- Inventor: Richard R. Hall , How T. Lin , Christopher J. Majka , Matthew F. Seward , Ronald V. Smith
- Applicant: Richard R. Hall , How T. Lin , Christopher J. Majka , Matthew F. Seward , Ronald V. Smith
- Main IPC: B23K3102
- IPC: B23K3102
Abstract:
An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.
Public/Granted literature
- US20030178471A1 Solid conductive element insertion apparatus Public/Granted day:2003-09-25
Information query
