发明授权
- 专利标题： Thermosetting low-dielectric resin composition and use thereof
- 专利标题（中）： 热固性低介电树脂组合物及其用途
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申请号： US10029991申请日： 2001-12-31
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公开(公告)号： US06713143B2公开(公告)日： 2004-03-30
- 发明人: Takeshi Hashimoto , Masaharu Kobayashi , Takeshi Sato , Daisuke Orino
- 申请人： Takeshi Hashimoto , Masaharu Kobayashi , Takeshi Sato , Daisuke Orino
- 优先权： JP331977/98 19981106; JP331978/98 19981106; JP331979/98 19981106; JP331980/98 19981106
- 主分类号： B32B1504
- IPC分类号： B32B1504
摘要：
A thermosetting low-dielectric resin composition which has a low dielectric constant and a low dielectric tangent for use in a printed circuit board and which has excellent adhesion to a metal and scatters almost no resin when used for forming a prepreg by punching or cutting, the composition comprising a component (a): siloxane-modified polyimide, component (b): a compound containing 2 methylallyl groups and having the following formula (1) or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c): a compound containing at least 2 maleimide groups. wherein R is a hydrogen atom or methyl group.