公开(公告)号：US06346598B1

公开(公告)日：2002-02-12

申请号：US09433281

申请日：1999-11-03

申请人： Takeshi Hashimoto ,  Masaharu Kobayashi ,  Takeshi Sato ,  Daisuke Orino

发明人： Takeshi Hashimoto ,  Masaharu Kobayashi ,  Takeshi Sato ,  Daisuke Orino

IPC分类号： C08G7310

CPC分类号： H05K1/0346 ,  B32B15/14 ,  B32B27/04 ,  C08G73/106 ,  C08K5/13 ,  C08K5/3445 ,  C08K5/34924 ,  C08K5/5455 ,  C08L79/08 ,  H05K3/4626 ,  Y10T428/12431 ,  Y10T428/14 ,  Y10T428/31663 ,  Y10T428/31721

摘要： A thermosetting low-dielectric resin composition which has a low dielectric constant and a low dielectric tangent for use in a printed circuit board and which has excellent adhesion to a metal and scatters almost no resin when used for forming a prepreg by punching or cutting, the composition comprising a component (a): siloxane-modified polyimide, component (b): a compound containing 2 methylallyl groups and having the following formula (1) or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c): a compound containing at least 2 maleimide groups, wherein R is a hydrogen atom or methyl group.

摘要翻译： 一种热固性低电介质树脂组合物，其具有低介电常数和低介电切线，用于印刷电路板，并且当用于通过冲压或切割形成预浸料时，其对金属具有优异的粘合性并且几乎不散射树脂， 组分（a）：硅氧烷改性的聚酰亚胺，组分（b）：含有2个甲基烯丙基并具有下式（1）的化合物或含有3个烯丙基或3个甲基烯丙基并具有下式（1A ）和组分（c）：含有至少2个马来酰亚胺基团的化合物，其中R是氢原子或甲基。

公开(公告)号：US06713143B2

公开(公告)日：2004-03-30

申请号：US10029991

申请日：2001-12-31

申请人： Takeshi Hashimoto ,  Masaharu Kobayashi ,  Takeshi Sato ,  Daisuke Orino

发明人： Takeshi Hashimoto ,  Masaharu Kobayashi ,  Takeshi Sato ,  Daisuke Orino

IPC分类号： B32B1504

CPC分类号： H05K1/0346 ,  B32B15/14 ,  B32B27/04 ,  C08G73/106 ,  C08K5/13 ,  C08K5/3445 ,  C08K5/34924 ,  C08K5/5455 ,  C08L79/08 ,  H05K3/4626 ,  Y10T428/12431 ,  Y10T428/14 ,  Y10T428/31663 ,  Y10T428/31721

摘要： A thermosetting low-dielectric resin composition which has a low dielectric constant and a low dielectric tangent for use in a printed circuit board and which has excellent adhesion to a metal and scatters almost no resin when used for forming a prepreg by punching or cutting, the composition comprising a component (a): siloxane-modified polyimide, component (b): a compound containing 2 methylallyl groups and having the following formula (1) or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c): a compound containing at least 2 maleimide groups. wherein R is a hydrogen atom or methyl group.

摘要翻译： 一种热固性低电介质树脂组合物，其具有低介电常数和低介电切线，用于印刷电路板，并且当用于通过冲压或切割形成预浸料时，其对金属具有优异的粘合性并且几乎不散射树脂， 组分（a）：硅氧烷改性的聚酰亚胺，组分（b）：含有2个甲基烯丙基并具有下式（1）的化合物或含有3个烯丙基或3个甲基烯丙基并具有下式（1A ）和组分（c）：含有至少2个马来酰亚胺基团的化合物，其中R是氢原子或甲基。

公开(公告)号：US06492030B1

公开(公告)日：2002-12-10

申请号：US09647217

申请日：2000-09-28

申请人： Takeshi Hashimoto ,  Masaharu Kobayashi ,  Takeshi Sato ,  Daisuke Orino

发明人： Takeshi Hashimoto ,  Masaharu Kobayashi ,  Takeshi Sato ,  Daisuke Orino

IPC分类号： B32B904

CPC分类号： H05K1/0346 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/106 ,  C08G73/1064 ,  C08G73/12 ,  C08G73/125 ,  H01B3/306 ,  H01B3/465 ,  Y10T428/31663 ,  Y10T428/31721

摘要： The present invention relates to a thermosetting low dielectric resin composition, a laminate for use in printed wiring, a laminate for a circuit, and the like. The present invention's thermosetting low dielectric resin composition contains a specific siloxane denatured polyimide, a compound having two or more allyl or methylallyl groups, and a compound having two or more maleimide groups. This resin composition adheres extremely well to metals with a low dielectric constant and low dielectric dissipation factor, and demonstrates very little scattering of the resin during operational processes like punching or cutting. By using laminates or laminates for circuits that employ this resin composition, electrical signals can be propagated more quickly, enabling signals to be processed at faster speeds. In addition, the present invention can be applied to the formation of miniaturized circuit wiring, and is suitably employed in electronic devices employed in the high frequency region, and, in particular, in electronic devices that must be made smaller and lighter in weight.

摘要翻译： 本发明涉及一种热固性低电介质树脂组合物，用于印刷布线的叠层体，电路用层压体等。 本发明的热固性低介电性树脂组合物含有特定的硅氧烷改性聚酰亚胺，具有2个以上烯丙基或甲基烯丙基的化合物和具有2个以上马来酰亚胺基的化合物。 该树脂组合物非常好地粘附在具有低介电常数和低介电损耗因子的金属上，并且在诸如冲压或切割的操作过程中表现出非常小的树脂散射。 通过对采用这种树脂组合物的电路使用层压板或层压板，可以更迅速地传播电信号，从而能够以更快的速度处理信号。 此外，本发明可以应用于形成小型化的电路布线，并且适用于在高频区域中使用的电子设备中，特别是在必须制造得更小更轻的电子设备中。