Invention Grant
US06716795B2 Buffer architecture for biaxially textured structures and method of fabricating same 失效
用于双轴织构结构的缓冲结构及其制造方法

  • Patent Title: Buffer architecture for biaxially textured structures and method of fabricating same
  • Patent Title (中): 用于双轴织构结构的缓冲结构及其制造方法
  • Application No.: US09406190
    Application Date: 1999-09-27
  • Publication No.: US06716795B2
    Publication Date: 2004-04-06
  • Inventor: David P. NortonChan ParkAmit Goyal
  • Applicant: David P. NortonChan ParkAmit Goyal
  • Main IPC: H01B1200
  • IPC: H01B1200
Buffer architecture for biaxially textured structures and method of fabricating same
Abstract:
The invention relates to an article with an improved buffer layer architecture comprising a substrate having a metal surface, and an epitaxial buffer layer on the surface of the substrate. The epitaxial buffer layer comprises at least one of the group consisting of ZrO2, HfO2, and compounds having at least one of Ca and a rare earth element stabilizing cubic phases of ZrO2 and/or HfO2. The article can also include a superconducting layer deposited on the epitaxial buffer layer. The article can also include an epitaxial capping layer between the epitaxial buffer layer and the superconducting layer. A method for preparing an epitaxial article comprises providing a substrate with a metal surface, depositing on the metal surface an epitaxial buffer layer comprising at least one material selected from the group consisting of ZrO2, HfO2, and compounds having at least one of Ca and a rare earth element stabilizing cubic phases of at least one of ZrO2 and HfO2. The epitaxial layer depositing step occurs in a vacuum with a background pressure of no more than 1×10−5 Torr. The method can further comprise depositing a superconducting layer on the epitaxial layer, and depositing an epitaxial capping layer between the epitaxial buffer layer and the superconducting layer.
Information query
Patent Agency Ranking
0/0