发明授权
US06734451B2 Aggregate of semiconductor micro-needles and method of manufacturing the same, and semiconductor apparatus and method of manufacturing the same 失效
半导体微针的集合体及其制造方法以及半导体装置及其制造方法

  • 专利标题: Aggregate of semiconductor micro-needles and method of manufacturing the same, and semiconductor apparatus and method of manufacturing the same
  • 专利标题(中): 半导体微针的集合体及其制造方法以及半导体装置及其制造方法
  • 申请号: US10274910
    申请日: 2002-10-22
  • 公开(公告)号: US06734451B2
    公开(公告)日: 2004-05-11
  • 发明人: Koji EriguchiMasafumi KubotaMasaaki NiwaNoboru Nomura
  • 申请人: Koji EriguchiMasafumi KubotaMasaaki NiwaNoboru Nomura
  • 优先权: JP5-274191 19931102; JP5-312747 19931117; JP6-162028 19940714
  • 主分类号: H01L2906
  • IPC分类号: H01L2906
Aggregate of semiconductor micro-needles and method of manufacturing the same, and semiconductor apparatus and method of manufacturing the same
摘要:
On a silicon substrate is formed a silicon dioxide film and then hemispherical grains made of silicon, each having an extremely small diameter, are deposited thereon by LPCVD. After annealing the hemispherical grains, the silicon dioxide film is etched using the hemispherical grains as a first dotted mask, thereby forming a second dotted mask composed of the silicon dioxide film. The resulting second dotted mask is used to etch the silicon substrate to a specified depth from the surface thereof, thereby forming an aggregate of semiconductor micro-needles. Since the diameter of each of the semiconductor micro-needles is sufficiently small to cause the quantum size effects as well as has only small size variations, remarkable quantum size effects can be obtained. Therefore, it becomes possible to constitute a semiconductor apparatus with a high information-processing function by using the aggregate of semiconductor micro-needles (quantized region).
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