A method and structure for a chip detach apparatus and method that limits the solder ball maximum shear rate and, more particularly, that delays the application of shear force until a minimum predefined temperature is reached. The chip detach apparatus and method can be applied to chips with high solder ball counts, chips with small solder ball sizes, and chips with weak surface strength. The chip detach apparatus and method measures and accounts for variability in the electronic module manufacturing and assembly.