公开(公告)号：US06319554B1

公开(公告)日：2001-11-20

申请号：US09329893

申请日：1999-06-10

申请人： Govindarajan Natarajan ,  Robert W. Pasco

发明人： Govindarajan Natarajan ,  Robert W. Pasco

IPC分类号： C23C1608

CPC分类号： H05K3/24 ,  C23C16/08 ,  C23C16/44

摘要： The present invention relates generally to a CVD (Chemical Vapor Deposition) process where at least one source metal, such as, nickel (Ni) or alloys thereof, for example, Ni/Cu, Ni/Co, are deposited on metal surfaces which are capable of receiving the source metal, such as, refractory metal, for example, molybdenum, tungsten or alloys thereof, using at least one gaseous Iodide source, such as, an iodic fluid, for example, hydriodic acid gas. The source metal is securely held in place by at least one high strength inert material. The CVD of nickel or alloys thereof, on the surface of refractory metal, such as, molybdenum (Mo) or tungsten (W), where the nickel source is physically isolated from the refractory metal surface to be plated using at least one high strength inert material that is in physical floating contact with the refractory metal surface that needs to be coated with at least one layer of nickel or alloy thereof, and where the nickel source and the high strength inert material are embodied as a single bonded structure.

摘要翻译： 本发明一般涉及一种CVD（化学气相沉积）方法，其中至少一种源金属例如镍（Ni）或其合金，例如Ni / Cu，Ni / Co沉积在金属表面上， 能够使用至少一种碘化物源（例如碘酸液体，例如氢碘酸气体）接收源金属，例如难熔金属，例如钼，钨或其合金。 源金属通过至少一种高强度惰性材料牢固地保持在适当位置。 在难熔金属表面，例如钼（Mo）或钨（W）的镍或其合金的CVD，其中镍源使用至少一种高强度惰性物质从要镀覆的难熔金属表面物理隔离 与需要涂覆有至少一层镍或其合金的难熔金属表面物理浮动接触的材料，以及其中镍源和高强度惰性材料被实施为单一结合结构的材料。

公开(公告)号：US4954142A

公开(公告)日：1990-09-04

申请号：US285435

申请日：1989-03-07

申请人： Jeffrey W. Carr ,  Lawrence D. David ,  William L. Guthrie ,  Frank B. Kaufman ,  William J. Patrick ,  Kenneth P. Rodbell ,  Robert W. Pasco ,  Anton Nenadic

发明人： Jeffrey W. Carr ,  Lawrence D. David ,  William L. Guthrie ,  Frank B. Kaufman ,  William J. Patrick ,  Kenneth P. Rodbell ,  Robert W. Pasco ,  Anton Nenadic

IPC分类号： B24B37/00 ,  C09G1/02 ,  H01L21/304 ,  H01L21/306 ,  H01L21/48

CPC分类号： H01L21/4871 ,  C09G1/02 ,  H01L21/4864

摘要： Disclosed is a method of chem-mech polishing an electronic component substrate. The method includes the following steps;obtaining a substrate having at least two features thereon or therein which have a different etch rate with respect to a particular etchant; andcontacting the substrate with a polishing pad while contacting the substrate with a slurry containing the etchant wherein the slurry includes abrasive particles, a transition metal chelated salt and a solvent for the salt.The chem-mech polishing causes the at least two features to be substantially coplanar. Also disclosed is the chem-mech polishing slurry.

摘要翻译： 公开了电子部件基板的化学研磨方法。 该方法包括以下步骤： 获得其上具有至少两个特征的衬底，其中相对于特定蚀刻剂具有不同的蚀刻速率; 以及使所述基板与抛光垫接触，同时使所述基板与含有所述蚀刻剂的浆料接触，其中所述浆料包括磨料颗粒，过渡金属螯合盐和所述盐的溶剂。 化学铣削使得至少两个特征基本上共面。 还公开了化学研磨浆料。

公开(公告)号：US4585672A

公开(公告)日：1986-04-29

申请号：US706175

申请日：1985-02-27

申请人： James A. Schwarz ,  Robert W. Pasco

发明人： James A. Schwarz ,  Robert W. Pasco

IPC分类号： H01F10/06 ,  H01L23/532 ,  B05D5/12

CPC分类号： H01F10/06 ,  H01L23/53223 ,  H01L2924/0002 ,  Y10S438/927

摘要： A thin film stripe that includes a conductive metal alloyed with at least one other element capable of chemically bonding with hydrogen and a compound formed by hydrogen chemically bonded with at least one other element in sufficient amounts to increase the stripe's resistance to electromigration failure at normal operating temperatures and pressures.

摘要翻译： 一种薄膜条纹，其包括与能够与氢化学键合的至少一种其它元件的导电金属和由与至少一种其它元素以足够量化学键合的氢化合物形成的化合物，以增加条纹在正常操作下对电迁移失败的抵抗力 温度和压力。

公开(公告)号：US4525734A

公开(公告)日：1985-06-25

申请号：US477503

申请日：1983-03-21

申请人： James A. Schwarz ,  Robert W. Pasco

发明人： James A. Schwarz ,  Robert W. Pasco

IPC分类号： H01F10/06 ,  H01L23/532 ,  H01L23/36 ,  H01L23/48

CPC分类号： H01L23/53223 ,  H01F10/06 ,  H01L2924/0002

摘要： A thin film conductive stripe having increased resistance to electromigration wherein a conductive element is alloyed with at least one other hydrogen storage element capable of accepting and holding hydrogen internally within the thin film stripe and the stripe is annealed in a hydrogen atmosphere to react hydrogen with the storage material to charge the stripe with hydrogen.

摘要翻译： 具有增加的电迁移阻力的薄膜导电条纹，其中导电元件与能够在薄膜条带内部接受和保持氢的至少一个其它储氢元件合金化，并且条带在氢气氛中退火以使氢与 储存材料用氢气充填条纹。

公开(公告)号：US4483629A

公开(公告)日：1984-11-20

申请号：US455852

申请日：1983-01-05

申请人： James A. Schwarz ,  Robert W. Pasco

发明人： James A. Schwarz ,  Robert W. Pasco

IPC分类号： G01N27/04 ,  G01R27/02 ,  G01R31/02 ,  G01R31/28 ,  G01N27/14

CPC分类号： G01N27/041 ,  G01R27/02 ,  G01R31/02 ,  G01R31/2831 ,  G01R31/2849

摘要： A technique is described that permits direct and accurate evaluation of a thin film conductor's reliability which requires only a few hours to carry out. The technique involves a temperature ramp procedure which dynamically exposes a conductor operating under constant current stress to a linear (in time) rise in temperature. Changes in resistivity of the conductor provides kinetic data that is directly related to both the electromigration process and the reliability of the device.

摘要翻译： 描述了一种技术，其允许直接和准确地评估薄膜导体的可靠性，其仅需要几个小时来执行。 该技术涉及一种温度斜坡过程，其将在恒定电流应力下工作的导体动态地暴露于线性（及时）温度升高。 导体的电阻率变化提供与电迁移过程和设备的可靠性直接相关的动力学数据。

公开(公告)号：US06562169B2

公开(公告)日：2003-05-13

申请号：US09765027

申请日：2001-01-17

申请人： Govindarajan Natarajan ,  Raschid J. Bezama ,  Jon A. Casey ,  Amy C. Flack ,  Robert W. Pasco ,  Arnold W. Terpening ,  Renee L. Weisman

发明人： Govindarajan Natarajan ,  Raschid J. Bezama ,  Jon A. Casey ,  Amy C. Flack ,  Robert W. Pasco ,  Arnold W. Terpening ,  Renee L. Weisman

IPC分类号： B32B3118

CPC分类号： B32B18/00 ,  C04B2235/6562 ,  C04B2237/068 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/366 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T156/1056 ,  Y10T156/1057

摘要： A method of processing greensheets, wherein the following steps are performed: a) providing a greensheet having a width, length, thickness, a first side and a second side; b) bonding to the first side of the greensheet at least one strip, wherein the strip lies in a first plane; c) bonding to the second side of the green sheet at least one strip, wherein the strip lies in a second plane; d) processing the greensheet; and e) removing the strips from the processed greensheet.

摘要翻译： 一种处理毛坯的方法，其中执行以下步骤：a）提供具有宽度，长度，厚度，第一侧面和第二侧面的毛坯; b）将至少一个条带结合到毛坯的第一侧，其中 所述条带位于第一平面中; c）将至少一个条带连接到所述生片的第二侧，其中所述条位于第二平面中; d）处理所述毛坯; 从处理过的毛坯上去除条带。

公开(公告)号：US06509687B1

公开(公告)日：2003-01-21

申请号：US09450530

申请日：1999-11-30

申请人： Govindarajan Natarajan ,  Raschid J. Bezama ,  John U. Knickerbocker ,  Robert W. Pasco

发明人： Govindarajan Natarajan ,  Raschid J. Bezama ,  John U. Knickerbocker ,  Robert W. Pasco

IPC分类号： H01J2964

CPC分类号： H01J29/467 ,  H01J31/127

摘要： The present invention relates generally to a new electrode forming metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.

摘要翻译： 本发明一般涉及具有通孔的新型电极形成金属/磁陶瓷层压体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积陶瓷层压体磁体的新方法，用于电子和电子束控制的集成金属板和共烧结电极。 本发明还涉及磁矩阵显示器（MMD）和电子束源，及其制造方法。

公开(公告)号：US06332782B1

公开(公告)日：2001-12-25

申请号：US09597919

申请日：2000-06-19

申请人： Raschid J. Bezama ,  Govindarajan Natarajan ,  Robert W. Pasco

发明人： Raschid J. Bezama ,  Govindarajan Natarajan ,  Robert W. Pasco

IPC分类号： H01R1200

CPC分类号： H05K1/141 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01R13/24 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/368 ,  H05K7/1061 ,  H05K2201/049 ,  H05K2201/09836 ,  H05K2201/10378 ,  H05K2201/10734

摘要： An interconnect substrate structure for electrical interconnection between two electronic modules having differing conductive array parameters. The interconnect structure comprises an interposer having a top surface and a bottom surface; a first set of conductive arrays having a first conductive array parameter on the top surface, and a second set of conductive arrays having a second conductive array parameter on the bottom surface, the second conductive array and the first conductive array having differing parameters. A plurality of conductors traverses a thickness of the interposer, with the conductors comprising a conductive material optionally coated with a dielectric material, the conductors having a first end at the first conductive arrays and a second end at the second conductive arrays, whereby the conductors connecting the first and second conductive arrays therein are adapted to spatially transform the differing parameters to provide an electrical interconnection. A conductive matrix surrounds the conductors. The first set of conductive arrays comprise the same conductive array parameters as a first electronic module and the second set of conductive arrays comprise the same conductive array parameters as a second electronic module.

摘要翻译： 一种互连衬底结构，用于具有不同导电阵列参数的两个电子模块之间的电互连。 互连结构包括具有顶表面和底表面的插入件; 具有在顶表面上具有第一导电阵列参数的第一组导电阵列和在底表面上具有第二导电阵列参数的第二组导电阵列，所述第二导电阵列和第一导电阵列具有不同的参数。 多个导体横穿插入件的厚度，导体包括任选地涂覆有电介质材料的导电材料，导体在第一导电阵列处具有第一端，在第二导电阵列处具有第二端，由此导体连接 其中的第一和第二导电阵列适于空间转换不同的参数以提供电互连。 导电矩阵围绕导体。 第一组导电阵列包括与第一电子模块相同的导电阵列参数，并且第二组导电阵列包括与第二电子模块相同的导电阵列参数。

公开(公告)号：US5882455A

公开(公告)日：1999-03-16

申请号：US937190

申请日：1997-09-25

申请人： Raschid J. Bezama ,  Govindarajan Natarajan ,  Robert W. Pasco

发明人： Raschid J. Bezama ,  Govindarajan Natarajan ,  Robert W. Pasco

IPC分类号： B32B37/18 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46 ,  B32B31/20

CPC分类号： B32B37/18 ,  B32B37/26 ,  H01L21/4807 ,  H05K3/4629 ,  B32B2315/02 ,  H05K1/0306 ,  H05K2203/068 ,  H05K2203/074

摘要： Disclosed is an apparatus for laminating a plurality of ceramic greensheets which includes a frame, a bottom plate at one end of the frame, a punch at a second end of the frame, and a non-metallic pad within the frame and between the bottom plate and punch. In operation, a plurality of ceramic greensheets are placed within the frame, the non-metallic pad is placed underneath of, or on top of, the plurality of ceramic greensheets, and pressure is applied to the non-metallic pad and the plurality of ceramic greensheets wherein the non-metallic pad causes the lamination pressure to be uniformly distributed across the plurality of ceramic greensheets. Also disclosed is a method for laminating a plurality of ceramic greensheets using the non-metallic pad.

摘要翻译： 公开了一种用于层叠多个陶瓷片材的装置，其包括框架，框架的一端处的底板，框架的第二端处的冲头和框架内的非金属垫片以及底板之间的非金属垫片 和打孔。 在操作中，将多个陶瓷刮板放置在框架内，将非金属垫放置在多个陶瓷刮板的下方或顶部，并且将压力施加到非金属垫和多个陶瓷 其中非金属垫使得层压压力均匀地分布在多个陶瓷刮板上。 还公开了使用非金属垫层压多个陶瓷片材的方法。

公开(公告)号：US5788808A

公开(公告)日：1998-08-04

申请号：US834304

申请日：1997-04-15

申请人： Govindarajan Natarajan ,  Robert W. Pasco ,  Charles H. Perry ,  Vincent P. Peterson

发明人： Govindarajan Natarajan ,  Robert W. Pasco ,  Charles H. Perry ,  Vincent P. Peterson

IPC分类号： H01L21/48 ,  B32B31/20

CPC分类号： B32B37/0023 ,  B32B37/26 ,  H01L21/4807 ,  B32B2315/02 ,  H01L2924/15787

摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.

摘要翻译： 本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。 更具体地说，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将固化的厚的可压缩弹性垫放置在空腔上方并使其符合空腔的轮廓，从而防止破坏或损坏 到层压过程中的腔架或角落。 在层压处理之后，固化的厚的可压缩弹性垫可以方便地从空腔区域移除，而不会对腔架或角落造成任何损坏或具有任何糊状物抽出。 该垫可以重复使用多次以形成这些MLC空腔衬底。