Test wafer consumption is a significant contributor to overall cost of manufacturing in semiconductor industry due to scrapping the test wafers after one monitoring of implantation parameters. This invention provides a method to reuse the same test wafer for monitoring the implantation parameters more than once. This method comprises the possibility of implanting the same implant species together with identical implanting and annealing conditions as well as of implanting a broad variety of implant species together with varying implanting and annealing conditions. Therefore, this invention helps to significantly reduce the number of test wafers consumed in the implant-area.