发明授权
- 专利标题: Ultraviolet curing processes for advanced low-k materials
- 专利标题(中): 先进的低k材料的紫外线固化工艺
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申请号: US10623729申请日: 2003-07-21
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公开(公告)号: US06756085B2公开(公告)日: 2004-06-29
- 发明人: Carlo Waldfried , Qingyuan Han , Orlando Escorcia , Ivan L. Berry, III
- 申请人: Carlo Waldfried , Qingyuan Han , Orlando Escorcia , Ivan L. Berry, III
- 主分类号: C08J704
- IPC分类号: C08J704
摘要:
Low dielectric constant materials with improved elastic modulus and material hardness. The process of making such materials involves providing a dielectric material and ultraviolet (UV) curing the material to produce a UV cured dielectric material. UV curing yields a material with improved modulus and material hardness. The improvement is each typically greater than or about 50%. The UV cured dielectric material can optionally be post-UV treated. The post-UV treatment reduces the dielectric constant of the material while maintaining an improved elastic modulus and material hardness as compared to the UV cured dielectric material. UV cured dielectrics can additionally exhibit a lower total thermal budget for curing than for furnace curing processes.