发明授权
- 专利标题： Method of installing a land grid array multi-chip modules
- 专利标题（中）： 安装地面阵列多芯片模块的方法
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申请号： US10455538申请日： 2003-06-05
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公开(公告)号： US06757965B2公开(公告)日： 2004-07-06
- 发明人: John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
- 申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
- 主分类号： H05K330
- IPC分类号： H05K330
摘要：
A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
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