利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.015 秒)

    Topside installation apparatus for land grid array modules
    1.
    发明授权
    Topside installation apparatus for land grid array modules 失效
    地面栅格阵列模块的顶部安装装置

    公开(公告)号：US06802733B2

    公开(公告)日：2004-10-12

    申请号：US09931299

    申请日：2001-08-16

    申请人： John L. Colbert ,  John S. Corbin, Jr. ,  Roger D. Hamilton ,  Danny E. Massey ,  Arvind K. Sinha

    发明人： John L. Colbert ,  John S. Corbin, Jr. ,  Roger D. Hamilton ,  Danny E. Massey ,  Arvind K. Sinha

    IPC分类号： H01R1362

    CPC分类号： H05K3/325 ,  H05K7/1061

    摘要： An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and springplate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.

    摘要翻译： 提供了一种用于致动陆地网格阵列模块到印刷线路板的电连接的安装装置和方法。 具有负载柱的背面加强件连接到印刷线路板。 负载板，模块，多个负载柱和弹簧板可操作地连接到负载柱。 可操作地连接到弹簧板的致动螺钉被旋转，向模块施加致动力。 背面加强件包括局部加强件，其中当施加致动力时，局部加强件引起印刷线路板中的挠曲与模块的偏转互补。

    Heat pipe heat sink assembly for cooling semiconductor chips
    4.
    发明授权
    Heat pipe heat sink assembly for cooling semiconductor chips 失效
    用于冷却半导体芯片的热管散热器组件

    公开(公告)号：US06385044B1

    公开(公告)日：2002-05-07

    申请号：US09917446

    申请日：2001-07-27

    申请人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Danny E. Massey ,  Arvind Kumar Sinha

    发明人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Danny E. Massey ,  Arvind Kumar Sinha

    IPC分类号： H05K720

    CPC分类号： H01L23/427 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat pipe is loaded against each chip with a predetermined force without the need for counting turns of a screw or use of torque measurement tools. Each heat pipe draws heat away from the chip it is loaded against, carrying the heat to a heat sink for dissipation into the ambient. A large multichip module can be loaded against a land grid array interposer with uniform loading of the interposer. This interposer loading is accomplished independently of the loading of the heat pipes against the chips.

    摘要翻译： 公开了一种为安装在模块上的半导体芯片提供热管冷却的装置和方法。 每个芯片都设有自己的热管用于冷却。 每个热管的端部上的活塞以预定的力加载到每个芯片上，而不需要计数螺杆的转数或使用扭矩测量工具。 每个热管将热量从其被加载的芯片上吸走，将热量传递到散热器以耗散到环境中。 一个大的多芯片模块可以被加载到具有均匀的插入器负载的焊盘栅格阵列插入器上。 该插入器负载独立于热管对芯片的负载而完成。

    Land grid array socket actuation hardware for MCM applications
    6.
    发明授权
    Land grid array socket actuation hardware for MCM applications 有权
    用于MCM应用的Land Grid阵列插座致动硬件

    公开(公告)号：US06475011B1

    公开(公告)日：2002-11-05

    申请号：US09948195

    申请日：2001-09-07

    申请人： Arvind K. Sinha ,  Roger D. Hamilton ,  John L. Colbert ,  John S. Corbin, Jr. ,  Danny E. Massey

    发明人： Arvind K. Sinha ,  Roger D. Hamilton ,  John L. Colbert ,  John S. Corbin, Jr. ,  Danny E. Massey

    IPC分类号： H01R1362

    CPC分类号： H05K3/325 ,  H01R43/205

    摘要： An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.

    摘要翻译： 一种用于向多芯片模块施加力的装置，印刷线路板和插入件，以便于其间的电接触，包括多个负载柱，负载传递板，弹簧构件，后侧加强板和弹簧 执行器。 负载柱固定在多芯片模块上并通过印刷电路板。 载荷传递板具有第一刚度。 弹簧构件设置在负载传递板附近并且具有小于第一刚度的第二刚度。 背面加强板设置在弹簧构件和印刷线路板之间，并且具有大于第二刚度的第三刚度。 弹簧致动器接合弹簧构件以向后侧加强板施加力，使得基板，插入器和印刷线路板保持接触。