Invention Grant
- Patent Title: Microelectromechanical switch
- Patent Title (中): 微机电开关
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Application No.: US10255839Application Date: 2002-09-27
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Publication No.: US06764872B2Publication Date: 2004-07-20
- Inventor: Tsen-Hwang Lin , Yu-Pei Chen , Darius L. Crenshaw
- Applicant: Tsen-Hwang Lin , Yu-Pei Chen , Darius L. Crenshaw
- Main IPC: H01L2100
- IPC: H01L2100

Abstract:
A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.
Public/Granted literature
- US20030075768A1 Microelectromechanical switch Public/Granted day:2003-04-24
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