- 专利标题： Semiconductor wafer and testing method for the same
-
申请号： US10385565申请日： 2003-03-12
-
公开(公告)号： US06768332B2公开(公告)日： 2004-07-27
- 发明人: Yueh Lung Lin , Ho Ming Tong , Yao Hsin Feng , Su Tao , Chi Cheng Pan , Kuo Pin Yang , Sung Ching Hung
- 申请人： Yueh Lung Lin , Ho Ming Tong , Yao Hsin Feng , Su Tao , Chi Cheng Pan , Kuo Pin Yang , Sung Ching Hung
- 优先权： TW91117403A 20020731
- 主分类号： G10R3126
- IPC分类号： G10R3126
摘要：
A semiconductor wafer includes a plurality of areas and an array of dice disposed within each of the areas. The feature of the present invention is that at least two fiducial marks are disposed in each of the areas. The present invention further provides a method of testing a sawed semiconductor wafer.
公开/授权文献
- US20040021479A1 Semiconductor wafer and testing method for the same 公开/授权日：2004-02-05
信息查询
