发明授权
- 专利标题： Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same
- 专利标题（中）： 具有无玻璃非导电层的电子器件封装的印刷电路板及其形成方法
-
申请号： US09342584申请日： 1999-06-29
-
公开(公告)号： US06781064B1公开(公告)日： 2004-08-24
- 发明人: Bernd K. Appelt , Anilkumar C. Bhatt , James W. Fuller, Jr. , John M. Lauffer , Voya R. Markovich , William J. Rudik , William E. Wilson
- 申请人： Bernd K. Appelt , Anilkumar C. Bhatt , James W. Fuller, Jr. , John M. Lauffer , Voya R. Markovich , William J. Rudik , William E. Wilson
- 主分类号： H05K103
- IPC分类号： H05K103
摘要：
A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package. This printed circuit board includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.
信息查询
