Vertical surface mount apparatus with thermal carrier and method

Invention Grant

US06781839B2 Vertical surface mount apparatus with thermal carrier and method 失效

Title translation: 具有热载体和方法的垂直表面贴装装置

Patent Title: Vertical surface mount apparatus with thermal carrier and method
Patent Title (中): 具有热载体和方法的垂直表面贴装装置
Application No.: US10457122

Application Date: 2003-06-09
Publication No.: US06781839B2

Publication Date: 2004-08-24
Inventor: Larry D. Kinsman , Jerry M. Brooks , Walter L. Moden
Applicant: Larry D. Kinsman , Jerry M. Brooks , Walter L. Moden
Main IPC: H05K720
IPC: H05K720

Abstract:

A high density vertical surface mount package and thermal carrier therefore including a heat sink.

Abstract(Chinese):

因此，高密度垂直表面安装封装和热载体包括散热器。

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