发明授权
- 专利标题： Multi-chip package having improved heat spread characteristics and method for manufacturing the same
- 专利标题（中）： 具有改进的散热特性的多芯片封装及其制造方法
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申请号： US10410011申请日： 2003-04-07
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公开(公告)号： US06781849B2公开(公告)日： 2004-08-24
- 发明人: Joong-hyun Baek , Tae-koo Lee , Min-ha Kim , Yun-hyeok Im
- 申请人： Joong-hyun Baek , Tae-koo Lee , Min-ha Kim , Yun-hyeok Im
- 优先权： KR10-2002-0025626 20020509
- 主分类号： H05K710
- IPC分类号： H05K710
摘要：
A multi-chip package (MCP) in which heat generated in first and second chips of the MCP is spread effectively and a method for manufacturing the same. The MCP includes first and second chips. The MCP further comprises a tape including a conductive material layer therein situated between the first chip and the second chip. Thus, the heat generated in the second chip can effectively spread to the outside through the tape.
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