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    Heat sink with cooling fins for semiconductor package
    3.
    发明授权
    Heat sink with cooling fins for semiconductor package 失效
    散热片散热片用于半导体封装

    公开(公告)号：US06498395B2

    公开(公告)日：2002-12-24

    申请号：US09843096

    申请日：2001-04-25

    申请人： Joong-hyun Baek ,  Min-ha Kim

    发明人： Joong-hyun Baek ,  Min-ha Kim

    IPC分类号： H01L2334

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus for cooling a semiconductor package and preventing heat concentration at the central part of a heat sink includes a heat sink for cooling mounted on a semiconductor package and a fan installed over the heat sink. The heat sink includes a base plate, a support bar installed over the base plate for supporting the fan, a plurality of parallel fins, whose lengths decrease in size from a peripheral part to a central part of the heat sink. The parallel fins extend from the base plate. The heat sink further includes air guide plates for guiding air flow in the heat sink to the central part thereof.

    摘要翻译： 用于冷却半导体封装并防止散热器中心部分的热集中的装置包括安装在半导体封装上的用于冷却的散热器和安装在散热器上的风扇。 散热器包括基板，安装在用于支撑风扇的基板上的支撑杆，多个平行翅片，其尺寸从散热器的周边部分到中心部分的尺寸减小。 平行翅片从基板延伸。 散热器还包括用于将散热器中的空气流引导到其中心部分的导气板。

    Semiconductor module
    5.
    发明授权
    Semiconductor module 有权
    半导体模块

    公开(公告)号：US08184439B2

    公开(公告)日：2012-05-22

    申请号：US12833470

    申请日：2010-07-09

    申请人： Joong-hyun Baek ,  Hee-jin Lee ,  Jin-kwon Bae

    发明人： Joong-hyun Baek ,  Hee-jin Lee ,  Jin-kwon Bae

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20472 ,  H01L23/38 ,  H01L2924/0002 ,  H05K7/20409 ,  H01L2924/00

    摘要： A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

    摘要翻译： 半导体模块包括产生热能的半导体封装，将热能从半导体封装传递到集热构件中的集热区的集热构件，将从集热构件和封装传递热能的散热构件传送到 以及通过热电效应将热能通过集热区域传递到散热构件的热电装置。 集热构件和散热构件可以以其他方式绝缘，因此热能由热电装置传递和控制。 封装可以是动态随机存取存储器（DRAM），微处理器，中央处理单元（CPU），图形处理单元（GPU）或闪存。 散热构件可以是固态盘（SSD）的外部壳体，并且热电装置可以是通过电力线控制的珀耳帖冷却器。

    SEMICONDUCTOR MODULE
    7.
    发明申请
    SEMICONDUCTOR MODULE 有权
    半导体模块

    公开(公告)号：US20110032679A1

    公开(公告)日：2011-02-10

    申请号：US12833470

    申请日：2010-07-09

    申请人： Joong-hyun Baek ,  Hee-jin Lee ,  Jin-kwon Bae

    发明人： Joong-hyun Baek ,  Hee-jin Lee ,  Jin-kwon Bae

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20472 ,  H01L23/38 ,  H01L2924/0002 ,  H05K7/20409 ,  H01L2924/00

    摘要： A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

    摘要翻译： 半导体模块包括产生热能的半导体封装，将热能从半导体封装传递到集热构件中的集热区的集热构件，将从集热构件和封装传递热能的散热构件传送到 以及通过热电效应将热能通过集热区域传递到散热构件的热电装置。 集热构件和散热构件可以以其他方式绝缘，因此热能由热电装置传递和控制。 封装可以是动态随机存取存储器（DRAM），微处理器，中央处理单元（CPU），图形处理单元（GPU）或闪存。 散热构件可以是固态盘（SSD）的外部壳体，并且热电装置可以是通过电力线控制的珀耳帖冷却器。

    Heat sink for semiconductor device and semiconductor module assembly including the heat sink
    8.
    发明申请
    Heat sink for semiconductor device and semiconductor module assembly including the heat sink 审中-公开
    包括散热片的半导体器件和半导体模块组件的散热片

    公开(公告)号：US20090129026A1

    公开(公告)日：2009-05-21

    申请号：US12292244

    申请日：2008-11-14

    申请人： Joong-hyun Baek ,  Hee-jin Lee ,  Sun-won Kang

    发明人： Joong-hyun Baek ,  Hee-jin Lee ,  Sun-won Kang

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L23/4275 ,  H01L2224/16225 ,  H01L2224/73253

    摘要： Provided are a heat sink and a heat sink semiconductor module assembly which may include an improved, cooling function. Each of the heat sinks may include a flat heat sink base having a first surface attached to semiconductor devices and a second surface externally exposed; first fins provided on a portion of the second surface of the heat sink base to which no clip is coupled; and second fins provided on portions of the second surface of the heat sink base to which a clip may be coupled. The semiconductor module assembly may secure the heat sinks to both surfaces of a semiconductor module using the clip. Accordingly, air may flow smoothly through the second fins on the portions to which the clip may be coupled, thereby improving the cooling function of the heat sinks.

    摘要翻译： 提供了散热器和散热半导体模块组件，其可以包括改进的冷却功能。 每个散热器可以包括平坦的散热器基座，其具有附接到半导体器件的第一表面和外部暴露的第二表面; 第一散热片设置在散热器基座的第二表面的没有夹子连接的部分上; 以及设置在所述散热器基座的所述第二表面的可以联接夹子的部分上的第二散热片。 半导体模块组件可以使用夹子将散热片固定到半导体模块的两个表面。 因此，空气可以平滑地流过夹子可以联接的部分上的第二鳍片，从而改善散热器的冷却功能。

    Heat pipe and heat pipe structure
    9.
    发明申请
    Heat pipe and heat pipe structure 审中-公开
    热管和热管结构

    公开(公告)号：US20060090884A1

    公开(公告)日：2006-05-04

    申请号：US11262837

    申请日：2005-11-01

    申请人： Sang-wook Park ,  Dong-ho Lee ,  Joong-hyun Baek

    发明人： Sang-wook Park ,  Dong-ho Lee ,  Joong-hyun Baek

    IPC分类号： F28D15/00

    CPC分类号： F28D15/0275 ,  F28D15/046

    摘要： A heat pipe structure may include a plurality of heat pipes. Each heat pipe may include at least one ring arranged to form a passage through which a gas flows, and at least one globe arranged to form a wick, or capillary structure through which a fluid may flow. The at least one ring and the at least one globe may be arranged in a tube, which may connect a heat source and a heat dissipation part, and the fluid may be a working fluid for transferring heat.

    摘要翻译： 热管结构可以包括多个热管。 每个热管可以包括布置成形成气体流过的通道的至少一个环和布置成形成流体可以流过的芯或毛细结构的至少一个球体。 至少一个环和至少一个球体可以布置在管中，管可以连接热源和散热部分，并且流体可以是用于传递热量的工作流体。