发明授权
- 专利标题： Method to make wafer laser marks visable after bumping process
- 专利标题（中）： 晶圆激光标记在碰撞过程之后可见的方法
-
申请号： US10176940申请日： 2002-06-21
-
公开(公告)号： US06784002B1公开(公告)日： 2004-08-31
- 发明人: Hui-Peng Wang , Kuo-Wei Lin , Hwei-Mei Yu , Ta-Yang Lin , Charles Tseng
- 申请人： Hui-Peng Wang , Kuo-Wei Lin , Hwei-Mei Yu , Ta-Yang Lin , Charles Tseng
- 主分类号： H01L2166
- IPC分类号： H01L2166
摘要：
A wafer bumping method comprising the following steps of. A wafer having fields is provided. The wafer having at least one wafer identification character formed thereon within one or more of the fields. A dry film resist is formed over the wafer. Portions of the dry film resist are selectively exposed field by field using a mask whereby the mask is shifted over the one or more fields containing the at least one wafer identification character so that the one or more fields containing the at least one wafer identification character is double exposed after the mask shift so that all of the one or more fields containing the at least one wafer identification character is completely exposed. The selectively exposed dry film resist is developed to remove the non-exposed portions of the dry film resist. Solder is plated over the wafer exposed by the removed portions of the dry film resist to form solder bumps within the fields not containing at least one wafer identification character so that the at least one wafer identification character is readable by optical character recognition.
信息查询
