发明授权
- 专利标题: Semiconductor device package with improved cooling
- 专利标题(中): 半导体器件封装具有改进的冷却
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申请号: US10267142申请日: 2002-10-08
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公开(公告)号: US06784540B2公开(公告)日: 2004-08-31
- 发明人: Charles S. Cardwell
- 申请人: Charles S. Cardwell
- 主分类号: H01L2324
- IPC分类号: H01L2324
摘要:
A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom. The metal clip or drain clip has a plurality, a parallel spaced fins extending from its outwardly facing surface.
公开/授权文献
- US20030067071A1 Semiconductor device package with improved cooling 公开/授权日:2003-04-10