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公开(公告)号:US06784540B2
公开(公告)日:2004-08-31
申请号:US10267142
申请日:2002-10-08
申请人: Charles S. Cardwell
发明人: Charles S. Cardwell
IPC分类号: H01L2324
CPC分类号: H01L23/492 , H01L23/3114 , H01L23/3185 , H01L23/3675 , H01L23/3733 , H01L23/4334 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L2224/0401 , H01L2224/29339 , H01L2224/32245 , H01L2224/73153 , H01L2224/73253 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/16152 , H01L2924/167 , H01L2924/181 , H01L2924/3011 , H01L2924/00
摘要: A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom. The metal clip or drain clip has a plurality, a parallel spaced fins extending from its outwardly facing surface.
摘要翻译: 芯片级封装具有半导体MOSFET管芯,其具有覆盖有感光性液体环氧树脂层的顶部电极表面,该层被光刻图案化以暴露电极表面的部分并且用作钝化层和作为焊接掩模。 然后在钝化层上形成可焊接接触层。 单个管芯的排水侧面向下安装在金属夹子或罐中,其中漏电极设置为与罐底部延伸的凸缘共面。 金属夹子或排水夹具有从其向外的表面延伸的多个平行间隔的翅片。
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公开(公告)号:USRE41559E1
公开(公告)日:2010-08-24
申请号:US11514327
申请日:2006-08-31
申请人: Charles S. Cardwell
发明人: Charles S. Cardwell
CPC分类号: H01L23/492 , H01L23/3114 , H01L23/3185 , H01L23/3675 , H01L23/3733 , H01L23/4334 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L2224/0401 , H01L2224/29339 , H01L2224/32245 , H01L2224/73153 , H01L2224/73253 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/16152 , H01L2924/167 , H01L2924/181 , H01L2924/3011 , H01L2924/00
摘要: A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom. The metal clip or drain clip has a plurality, a parallel spaced fins extending from its outwardly facing surface.
摘要翻译: 芯片级封装具有半导体MOSFET管芯,其具有覆盖有感光性液体环氧树脂层的顶部电极表面,该层被光刻图案化以暴露电极表面的部分并且用作钝化层和作为焊接掩模。 然后在钝化层上形成可焊接接触层。 单个管芯的排水侧面向下安装在金属夹子或罐中,其中漏电极设置为与罐底部延伸的凸缘共面。 金属夹子或排水夹具有从其向外的表面延伸的多个平行间隔的翅片。
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