发明授权
- 专利标题： Cleaning fluid and cleaning method for component of semiconductor-treating apparatus
- 专利标题（中）： 半导体处理装置的部件的清洗液和清洗方法
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申请号： US09700704申请日： 2000-11-24
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公开(公告)号： US06805135B1公开(公告)日： 2004-10-19
- 发明人: Kenichi Hirota , Hitoshi Yamada , Kiyoshi Yuasa , Eiji Yamaguchi , Shinichi Kawaguchi , Takahiro Shimoda , Nobuyuki Nagayama
- 申请人： Kenichi Hirota , Hitoshi Yamada , Kiyoshi Yuasa , Eiji Yamaguchi , Shinichi Kawaguchi , Takahiro Shimoda , Nobuyuki Nagayama
- 优先权： JP10-183230 19980526
- 主分类号： C32G100
- IPC分类号： C32G100
摘要：
A cleaning solution is used to remove a byproduct derived from a decomposed substance of a process gas containing C and F. The cleaning solution contains 75 wt % N-methyl-2-pyrrolidone, 15 wt % ethylene glycol monobutyl ether, 0.5 wt % surfactant, and 9.5 wt % water. The content of an alkali metal in the cleaning solution is set to be less than 10 ppb.