A method for automatically controlling defect-specification in a semiconductor manufacturing process is provided. The method provides a module to detect a position, number, size, and intensity signals of defects on a processed patterned wafer. The module further compares the patterned wafer with a normal wafer to preliminarily classify the patterned wafer and creates a defect map. Then, a defect management system is provided to execute a spatial pattern recognition procedure to determine whether or not the corresponding special pattern can be recognized. Finally, messages will be automatically sent by the defect management system to inform related e-mail accounts according to results of the recognition of the special pattern.