A process for manufacturing a wafer carrier including injection molding a wafer support structure. The wafer support structure has a plurality of wafer support shelves extending therefrom. The process further includes molding a wafer contact portion on each of the wafer support shelves. The wafer contact portions bond with the wafer support shelves without mechanical fasteners between the wafer contact portions and the wafer support shelves. The process also includes overmolding a shell over the wafer support structure to form the wafer carrier. The shell bonds with the wafer support structure without mechanical fasteners between the shell and the wafer support structure. The wafer contact portions define a plurality of slots for holding a plurality of wafers.