发明授权
- 专利标题: Method and apparatus for treating surface of substrate plate
- 专利标题(中): 用于处理基板表面的方法和装置
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申请号: US09988559申请日: 2001-11-20
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公开(公告)号: US06821906B2公开(公告)日: 2004-11-23
- 发明人: Kenya Wada , Kazuto Kinoshita , Kazuhiko Gommori
- 申请人: Kenya Wada , Kazuto Kinoshita , Kazuhiko Gommori
- 优先权: JP2001-182679 20010618
- 主分类号: H01L2100
- IPC分类号: H01L2100
摘要:
Method and apparatus for treating a surface of a substrate plate under irradiation of ultraviolet ray emitted from a dielectric barrier discharge lamp. Upon admission into a treating chamber, oxygen is removed from a treating surface and surrounding atmosphere of a substrate plate in order to suppress energy losses of ultraviolet ray to a minimum.
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