发明授权
- 专利标题: High speed circuit board and method for fabrication
- 专利标题(中): 高速电路板及其制造方法
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申请号: US10354000申请日: 2003-01-30
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公开(公告)号: US06828514B2公开(公告)日: 2004-12-07
- 发明人: Benson Chan , John M. Lauffer , How T. Lin , Voya R. Markovich , David L. Thomas
- 申请人: Benson Chan , John M. Lauffer , How T. Lin , Voya R. Markovich , David L. Thomas
- 主分类号: H05K706
- IPC分类号: H05K706
摘要:
A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.
公开/授权文献
- US20040150969A1 High speed circuit board and method for fabrication 公开/授权日:2004-08-05