公开(公告)号：US07152319B2

公开(公告)日：2006-12-26

申请号：US10811817

申请日：2004-03-30

申请人： Benson Chan ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

发明人： Benson Chan ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H01K3/10

CPC分类号： H05K3/4688 ,  H01L23/3128 ,  H01L23/5383 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/113 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.

摘要翻译： 包括两个多层部分的多层PCB，其中之一能够电连接安装在PCB上的电子部件，以确保其间的高频连接。 PCB还包括常规PCB部分以降低成本，同时确保具有令人满意的整体厚度的结构以用于PCB领域。 这些组件的内部部分也可以进行耦合。 也提供了制造这些结构的方法。

公开(公告)号：US06828514B2

公开(公告)日：2004-12-07

申请号：US10354000

申请日：2003-01-30

申请人： Benson Chan ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

发明人： Benson Chan ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H05K706

CPC分类号： H05K3/4688 ,  H01L23/3128 ,  H01L23/5383 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/113 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.

摘要翻译： 包括两个多层部分的多层PCB，其中之一能够电连接安装在PCB上的电子部件，以确保其间的高频连接。 PCB还包括常规PCB部分以降低成本，同时确保具有令人满意的整体厚度的结构以用于PCB领域。 这些组件的内部部分也可以进行耦合。 也提供了制造这些结构的方法。

公开(公告)号：US07326643B2

公开(公告)日：2008-02-05

申请号：US11808596

申请日：2007-06-12

申请人： Subahu D. Desai ,  How T. Lin ,  John M. Lauffer ,  Voya R. Markovich ,  David L. Thomas

发明人： Subahu D. Desai ,  How T. Lin ,  John M. Lauffer ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H01L21/4751

CPC分类号： G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

摘要： A method of making circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device.

摘要翻译： 一种制造电路化衬底的方法，所述电路化衬底由其上具有导电图案的至少一种电介质材料组成。 图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成 设备。

公开(公告)号：US07253502B2

公开(公告)日：2007-08-07

申请号：US10900385

申请日：2004-07-28

申请人： Subahu D. Desai ,  How T. Lin ,  John M. Lauffer ,  Voya R. Markovich ,  David L. Thomas

发明人： Subahu D. Desai ,  How T. Lin ,  John M. Lauffer ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H01L23/58

CPC分类号： G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

摘要： A circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly capable of using the substrate is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.

摘要翻译： 一种电路化衬底，由至少一层具有导电图案的电介质材料构成。 图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成 设备。 衬底优选地与其它介电电路分层组件组合以形成多层衬底，在多层衬底上，可以将耦合到内部存储器件的分立电子部件（例如，逻辑芯片）放置在其上以与之组合工作。 还提供了能够使用基板的电气组件，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。

公开(公告)号：US07045897B2

公开(公告)日：2006-05-16

申请号：US10900386

申请日：2004-07-28

申请人： Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

发明人： Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H01L23/48

CPC分类号： G11C5/06 ,  B82Y10/00 ,  G02B6/43 ,  H01L23/48 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/16 ,  H05K1/181 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical assembly which includes a circuitized substrate comprised of an organic dielectric material having a first electrically conductive pattern thereon. At least part of the dielectric layer and pattern form the first, base portion of an organic memory device, the remaining portion being a second, polymer layer formed over the part of the pattern and a second conductive circuit formed on the polymer layer. A second dielectric layer if formed over the second conductive circuit and first circuit pattern to enclose the organic memory device. The device is electrically coupled to a first electrical component through the second dielectric layer and this first electrical component is electrically coupled to a second electrical component. A method of making the electrical assembly is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.

公开(公告)号：US07449381B2

公开(公告)日：2008-11-11

申请号：US11352279

申请日：2006-02-13

申请人： Rabindra N. Das ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

发明人： Rabindra N. Das ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

IPC分类号： H01L21/8234 ,  H01L21/00

CPC分类号： H05K1/162 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/013 ,  H05K2203/0568

摘要： A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.

摘要翻译： 一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成 至少两个电容器作为衬底的内部元件。 电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。 还提供了一种制造包括这种基板的信息处理系统的方法。

公开(公告)号：US07429510B2

公开(公告)日：2008-09-30

申请号：US11352276

申请日：2006-02-13

申请人： Rabindra N. Das ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

发明人： Rabindra N. Das ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

IPC分类号： H01L21/8242 ,  H05K1/16

CPC分类号： H05K1/162 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/0568

摘要： A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. Photoimageable material is used to facilitate positioning of the capacitive dielectric being printed. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.

摘要翻译： 一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成 至少两个电容器作为衬底的内部元件。 可光成像材料用于促进正在印刷的电容电介质的定位。 电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。 还提供了一种制造包括这种基板的信息处理系统的方法。

公开(公告)号：US07897877B2

公开(公告)日：2011-03-01

申请号：US11438424

申请日：2006-05-23

申请人： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

发明人： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H01L27/12 ,  H01L28/40 ,  H05K1/0306 ,  H05K3/125 ,  H05K3/4667 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2203/013

摘要： A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.

摘要翻译： 电容性基板及其制造方法，其中使用第一和第二玻璃层。 第一导体形成在第一玻璃层上，并且电容电介质材料位于导体上方。 然后将第二导体定位在电容电介质上，并且第二玻璃层位于第二导体上。 形成导电通孔以分别耦合到第一和第二导体，使得当电容基板工作时，导体和电容电介质材料形成电容器。

公开(公告)号：US07629559B2

公开(公告)日：2009-12-08

申请号：US11305073

申请日：2005-12-19

申请人： Subahu D. Desai ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  Ronald V. Smith

发明人： Subahu D. Desai ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  Ronald V. Smith

IPC分类号： H05B1/02

CPC分类号： H05K3/4069 ,  H05K1/0293 ,  H05K3/105 ,  H05K2201/096 ,  H05K2203/105

摘要： A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.

摘要翻译： 一种改进电路化基板中的导电糊料连接的方法，其中施加至少一个并且优选一系列高压脉冲施加在该糊料上并且至少一个并且优选地一系列高电流脉冲，两个脉冲串分别施加 。 结果是通过粘合连接的导电路径的数量从在脉冲应用之前存在的导电路径的数量增加以及所述连接中相应的电阻减小。

公开(公告)号：US07803688B2

公开(公告)日：2010-09-28

申请号：US12380616

申请日：2009-03-02

申请人： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

发明人： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

IPC分类号： H01L21/20

CPC分类号： H05K1/162 ,  H01L27/12 ,  H01L28/40 ,  H05K1/0306 ,  H05K3/125 ,  H05K3/4667 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2203/013

摘要： A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.

摘要翻译： 电容性基板及其制造方法，其中使用第一和第二玻璃层。 第一导体形成在第一玻璃层上，并且电容电介质材料位于导体上方。 然后将第二导体定位在电容电介质上，并且第二玻璃层位于第二导体上。 形成导电通孔以分别耦合到第一和第二导体，使得当电容基板工作时，导体和电容电介质材料形成电容器。