发明授权
- 专利标题: Semiconductor light emitting device and fabrication method thereof
- 专利标题(中): 半导体发光器件及其制造方法
-
申请号: US10024883申请日: 2001-12-17
-
公开(公告)号: US06828591B2公开(公告)日: 2004-12-07
- 发明人: Hiroyuki Okuyama , Masato Doi , Goshi Biwa , Toyoharu Oohata
- 申请人: Hiroyuki Okuyama , Masato Doi , Goshi Biwa , Toyoharu Oohata
- 优先权: JPP2000-381249 20001215
- 主分类号: H01L3300
- IPC分类号: H01L3300
摘要:
Semiconductor light emitting devices and methods of producing same are provided. The semiconductor light emitting devices include a substrate that has a surface including a difference-in-height portion composed of, for example, a wurtzite compound. A crystal growth layer is formed in the substrate surface wherein at least a portion of which is oriented along an inclined plane with respect to a principal plane of the substrate. The semiconductor device includes a first conductive layer, an active layer and a second conductive layer formed on the crystal layer in a stacked arrangement and oriented along the inclined place.
公开/授权文献
信息查询