Crystal film, crystal substrate, and semiconductor device
    1.
    发明授权
    Crystal film, crystal substrate, and semiconductor device 有权
    晶体膜,晶体基板和半导体器件

    公开(公告)号:US08741451B2

    公开(公告)日:2014-06-03

    申请号:US11976246

    申请日:2007-10-23

    Abstract: A crystal foundation having dislocations is used to obtain a crystal film of low dislocation density, a crystal substrate, and a semiconductor device. One side of a growth substrate (11) is provided with a crystal layer (13) with a buffer layer (12) in between. The crystal layer (13) has spaces (13a), (13b) in an end of each threading dislocation D1 elongating from below. The threading dislocation D1 is separated from the upper layer by the spaces (13a), (13b), so that each threading dislocation D1 is blocked from propagating to the upper layer. When the displacement of the threading dislocation D1 expressed by Burgers vector is preserved to develop another dislocation, the spaces (13a), (13b) vary the direction of its displacement. As a result, the upper layer above the spaces (13a), (13b) turns crystalline with a low dislocation density.

    Abstract translation: 使用具有位错的晶体基底来获得位错密度低的晶体膜,晶体基板和半导体器件。 生长衬底(11)的一侧设置有在其间具有缓冲层(12)的晶体层(13)。 在从下方延伸的每个穿透位错D1的端部中,晶体层(13)具有空间(13a),(13b)。 穿透位错D1通过空间(13a),(13b)与上层分开,使得每个穿透位错D1被阻止传播到上层。 当由汉堡矢量表示的穿透位错D1的位移被保留以产生另一个位错时,空间(13a),(13b)改变其位移的方向。 结果,空间(13a),(13b)上方的上层以低位错密度变成结晶。

    Crystal firm, crystal substrate, and semiconductor device
    2.
    发明申请
    Crystal firm, crystal substrate, and semiconductor device 失效
    水晶公司,晶体基板和半导体器件

    公开(公告)号:US20070125996A1

    公开(公告)日:2007-06-07

    申请号:US11699999

    申请日:2007-01-31

    Abstract: A crystal foundation having dislocations is used to obtain a crystal film of low dislocation density, a crystal substrate, and a semiconductor device. One side of a growth substrate (11) is provided with a crystal layer (13) with a buffer layer (12) in between. The crystal layer (13) has spaces (13a), (13b) in an end of each threading dislocation D1 elongating from below. The threading dislocation D1 is separated from the upper layer by the spaces (13a), (13b), so that each threading dislocation D1 is blocked from propagating to the upper layer. When the displacement of the threading dislocation D1 expressed by Burgers vector is preserved to develop another dislocation, the spaces (13a), (13b) vary the direction of its displacement. As a result, the upper layer above the spaces (13a), (13b) turns crystalline with a low dislocation density.

    Abstract translation: 使用具有位错的晶体基底来获得位错密度低的晶体膜,晶体基板和半导体器件。 生长衬底(11)的一侧设置有在其间具有缓冲层(12)的晶体层(13)。 晶体层(13)在从下方延伸的每个穿透位错D 1 1的末端具有间隔(13a),(13b)。 穿透位错D 1< 1>通过空间(13a),(13b)从上层分离,使得每个穿透位错D 1 1被阻止传播到 上层。 当由汉堡矢量表示的穿透位错D 1 1的位移被保留以产生另一位错时,空间(13a),(13b)改变其位移的方向。 结果,空间(13a),(13b)上方的上层以低位错密度变为结晶。

    ATMOSPHERE IMPROVING TAPE FOR PACKAGE, PACKAGE WITH ATMOSPHERE IMPROVING TAPE AND METHOD OF MANUFACTURING THE PACKAGE, PACKAGE CONTAINER WITH ATMOSPHERE IMPROVING TAPE, ENGAGING DEVICE , AND PACKAGE WITH ENGAGING DEVICE
    3.
    发明申请
    ATMOSPHERE IMPROVING TAPE FOR PACKAGE, PACKAGE WITH ATMOSPHERE IMPROVING TAPE AND METHOD OF MANUFACTURING THE PACKAGE, PACKAGE CONTAINER WITH ATMOSPHERE IMPROVING TAPE, ENGAGING DEVICE , AND PACKAGE WITH ENGAGING DEVICE 审中-公开
    用于包装的大气带,具有大气改进带的包装和制造包装的方法,包装容器与大气改进带,接合装置以及具有接合装置的包装

    公开(公告)号:US20070122573A1

    公开(公告)日:2007-05-31

    申请号:US11608628

    申请日:2006-12-08

    CPC classification number: B65D33/2541 B65D81/268

    Abstract: The atmosphere improving tape 10 for a package comprising a rectangular atmosphere improving layer 10A in the inner side and a thermoplastic resin layer 10B surrounding the atmosphere improving layer in the outer side. The atmosphere improving layer 10A contains an atmosphere improving material such as an deoxidizing agent. With the present invention, miss use and injection miss of an atmosphere improving material never occur, and a packaging material can freely be selected with no load to the environment. The tape is excellent in the formability, and the atmosphere improving capability can easily be given to the tape.

    Abstract translation: 用于包括内侧的矩形气氛改进层10A和包围外侧的气氛改进层的热塑性树脂层10B的包装的气氛改进带10。 气氛改善层10A含有脱气剂等气氛改善材料。 通过本发明,不会发生气氛改善材料的缺失使用和注入缺失,并且可以在无负载的情况下自由选择包装材料到环境中。 胶带的成形性优异,并且可以容易地对胶带赋予气氛提高能力。

    Chip resistor and method for making the same
    9.
    发明授权
    Chip resistor and method for making the same 有权
    贴片电阻及其制作方法

    公开(公告)号:US07098768B2

    公开(公告)日:2006-08-29

    申请号:US10496953

    申请日:2002-11-28

    Applicant: Masato Doi

    Inventor: Masato Doi

    Abstract: A chip resistor includes: an insulating chip substrate 11 having an upper surface formed with a resistive film 12 and a pair of left and right upper electrodes 13 at two ends thereof; a cover coat 14 covering the resistive film; auxiliary upper electrodes 15 formed on upper surfaces of the upper electrodes 13 to overlap the cover coat 14; a left and a right side electrodes 16 formed on a left and a right end surfaces 11a of the insulating substrate 11; and metal plate layers formed on surfaces of the auxiliary upper electrodes and side electrodes. The cover coat 14 is formed with an uppermost over coat 19 covering a region where the auxiliary upper electrodes 15 overlap the cover coat 14, whereby the upper electrodes 13 and the auxiliary upper electrodes 15 are protected from migration caused by sulfur gases.

    Abstract translation: 芯片电阻器包括:绝缘芯片基板11,其上表面形成有电阻膜12和在其两端的一对左右上电极13; 覆盖电阻膜的覆盖层14; 形成在上电极13的上表面上的辅助上电极15与覆盖层14重叠; 形成在绝缘基板11的左右端面11a上的左右电极16; 以及形成在辅助上电极和侧电极的表面上的金属板层。 覆盖层14形成有覆盖辅助上部电极15与覆盖层14重叠的区域的最上层涂层19,由此上部电极13和辅助上部电极15被保护以免由硫气引起的迁移。

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