发明授权
- 专利标题: Heated filling device
- 专利标题(中): 加热灌装装置
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申请号: US10026135申请日: 2001-12-20
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公开(公告)号: US06832714B2公开(公告)日: 2004-12-21
- 发明人: Jesse Pedigo , Timothy Meyer
- 申请人: Jesse Pedigo , Timothy Meyer
- 主分类号: B23K3700
- IPC分类号: B23K3700
摘要:
A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a beating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head\, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.
公开/授权文献
- US20020088840A1 Heated filling device 公开/授权日:2002-07-11
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