公开(公告)号：US06797224B2

公开(公告)日：2004-09-28

申请号：US10026382

申请日：2001-12-20

申请人： Jesse Pedigo ,  Timothy Meyer

发明人： Jesse Pedigo ,  Timothy Meyer

IPC分类号： B29C6708

CPC分类号： H05K3/1233 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  H05K2203/1105

摘要： A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a heating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.

摘要翻译： 填充系统包括加压填充源和压力填充头，其中填充头还包括加热元件，其被定位成传递热量以填充通过填充头的材料。 使用通过压力填充头的填充材料填充孔的方法包括以下步骤：使填充材料进入填充头，在填充头内部改变填充材料的粘度，并且使改性粘度填充材料 退出填充头并进入至少一个孔。

公开(公告)号：US06832714B2

公开(公告)日：2004-12-21

申请号：US10026135

申请日：2001-12-20

申请人： Jesse Pedigo ,  Timothy Meyer

发明人： Jesse Pedigo ,  Timothy Meyer

IPC分类号： B23K3700

CPC分类号： H05K3/1233 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  H05K2203/1105

摘要： A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a beating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head\, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.

摘要翻译： 填充系统包括加压填充源和压力填充头，其中填充头还包括打浆元件，该打浆元件定位成传递热量以填充通过填充头的材料。 使用通过压力填充头的填充材料填充孔的方法包括以下步骤：使填充材料进入填充头\，在填充头内部改变填充材料的粘度，并且使修饰粘度填充 材料离开填充头并进入至少一个孔。

公开(公告)号：US06923882B2

公开(公告)日：2005-08-02

申请号：US09818324

申请日：2001-03-26

申请人： Nancy E. Iwamoto ,  Jesse Pedigo ,  Stephen Tisdale

发明人： Nancy E. Iwamoto ,  Jesse Pedigo ,  Stephen Tisdale

IPC分类号： H01L21/60 ,  B32B27/04 ,  B32B31/06 ,  B32B31/12

CPC分类号： B32B27/04 ,  H01L2924/0002 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/30 ,  H01L2924/00

摘要： An assembly having a thermosetting layer pierced by a plurality of conductors is formed on a release sheet and subsequently sandwiched between an IC and a PWB or other supporting surface and subsequently cured. The release sheet is removed either before or during curing of the thermosetting material. Removal prior to curing may be accomplished via peeling. Removal during curing may be by destruction of the layer by the curing process.

摘要翻译： 具有由多个导体刺穿的热固化层的组件形成在剥离片上，随后夹在IC和PWB或其他支撑表面之间，随后固化。 在热固性材料固化之前或期间，将剥离片除去。 固化前的去除可以通过剥离来实现。 固化期间的去除可能是通过固化过程破坏层。

公开(公告)号：US06855385B2

公开(公告)日：2005-02-15

申请号：US10201450

申请日：2002-07-22

申请人： Charles W. Lewis ,  Jesse Pedigo ,  Joseph Schug

发明人： Charles W. Lewis ,  Jesse Pedigo ,  Joseph Schug

IPC分类号： H05K3/12 ,  H05K3/40 ,  F16B2/00 ,  B32B3/10

CPC分类号： H05K3/1233 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  Y10T428/24264 ,  Y10T428/24273

摘要： Apparatus for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.

摘要翻译： 用于改进电子基板通孔和通孔填充的装置，特别是通过使用通过控制深度钻孔过大的非贯通孔形成的钻孔支座以及使用插入的支撑柱来防止在填充期间底板松弛。 特别地：（1）适于与包含至少两个要填充的通孔的基板一起使用的通孔填充支座，每个通孔的直径为X密耳，所述支座包括至少一个通过控制 - 深度钻孔直径至少为12X密耳的孔; 和（2）适于与包括要填充的至少一个通孔的基板一起使用的通孔填充支座，所述支座包括：至少一个凹部; 以及定位在所述凹部内的至少一个支撑柱，其中所述支撑柱不是所述支座的组成部分。

公开(公告)号：US06800232B2

公开(公告)日：2004-10-05

申请号：US10201416

申请日：2002-07-22

申请人： Charles W. Lewis ,  Jesse Pedigo ,  Joseph Schug

发明人： Charles W. Lewis ,  Jesse Pedigo ,  Joseph Schug

IPC分类号： B29C6556

CPC分类号： H05K3/1233 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  Y10T29/49165

摘要： Methods for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular, through the use of: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.

摘要翻译： 用于改进电子基板通孔和通孔填充的方法，特别是通过使用通过控制深度钻孔超大非贯穿孔形成的钻孔支座以及使用插入的支撑柱来防止在填充期间底板的松弛。 特别地，通过使用：（1）适于与包括至少两个要填充的通孔的基板一起使用的通孔填充支架，每个通孔具有X密耳的直径，所述支座包括至少一个 通过直径至少为12X密耳的孔的控制深度钻孔形成的凹陷; 和（2）适于与包括要填充的至少一个通孔的基板一起使用的通孔填充支座，所述支座包括：至少一个凹部; 以及定位在所述凹部内的至少一个支撑柱，其中所述支撑柱不是所述支座的组成部分。