发明授权
US06836004B2 Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame 失效
引线框架及半导体器件的制造方法以及使用引线框检测小型器件的电气特性的方法

  • 专利标题: Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame
  • 专利标题(中): 引线框架及半导体器件的制造方法以及使用引线框检测小型器件的电气特性的方法
  • 申请号: US10342398
    申请日: 2003-01-15
  • 公开(公告)号: US06836004B2
    公开(公告)日: 2004-12-28
  • 发明人: Kazunari MichiiNaoyuki ShinonagaShinji Semba
  • 申请人: Kazunari MichiiNaoyuki ShinonagaShinji Semba
  • 优先权: JP2002-217694 20020726
  • 主分类号: H01L23495
  • IPC分类号: H01L23495
Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame
摘要:
A lead frame comprises a plurality of frame assemblies. Each framework assembly includes a framework, a suspension lead, a die pad, a plurality of inner leads and outer leads, a first tie bar and a second tie bar, and a lead support. The plurality of framework assemblies are disposed alongside of one another in a direction perpendicular to a direction in which the plurality of outer leads extend. A distance between close-set outer leads in each two neighboring frameworks is substantially n times a pitch of the plurality of outer leads in each framework, wherein n is an integer.
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