公开(公告)号：US07166490B2

公开(公告)日：2007-01-23

申请号：US10336801

申请日：2003-01-06

申请人： Kazunari Michii ,  Naoyuki Shinonaga ,  Shinji Semba

发明人： Kazunari Michii ,  Naoyuki Shinonaga ,  Shinji Semba

IPC分类号： H01L21/44

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of semiconductor chips is mounted on a surface of a substrate to be used for manufacturing semiconductor devices. The semiconductor chips are collectively sealed with resin, thereby forming resin-sealed sections. A plurality of solder balls are formed on the back surface of the substrate such that an interval A between the closest solder balls of adjacent semiconductor chips becomes “n” times (“n” is an integer greater than 1) an interval B between the solder balls on the semiconductor chip. After the semiconductor chips have been subjected to an electrical test, the resin-sealed sections and the substrate are sliced, thus breaking the semiconductor chips into pieces.

摘要翻译： 多个半导体芯片安装在用于制造半导体器件的基板的表面上。 半导体芯片被树脂共同密封，从而形成树脂密封部。 在基板的背面形成多个焊球，使得相邻的半导体芯片的最近的焊球之间的间隔A成为“n”倍（“n”是大于1的整数），焊料间的间隔B 半导体芯片上的球。 在半导体芯片进行电气测试之后，将树脂密封部分和基板切片，从而将半导体芯片分解成块。

公开(公告)号：US06955264B2

公开(公告)日：2005-10-18

申请号：US10145154

申请日：2002-05-15

申请人： Toshiya Ijichi ,  Shinji Semba

发明人： Toshiya Ijichi ,  Shinji Semba

IPC分类号： G01R31/26 ,  G01N21/956 ,  B07C5/00

CPC分类号： G01N21/956

摘要： In order to provide a method of detecting protrusion of an inspection object from a palette improved to be capable of making highly precise detection and reducing a socket breakage ratio, an inspection object is introduced into each of a plurality of pockets provided on the surface of a palette, which in turn is transported. A reflection level of the inspection object stored in each of the plurality of pockets is measured every palette with a reflection type photoelectric sensor. The maximum value and the minimum value of the reflection level are obtained from data of every palette, for calculating a dispersion width defined by the difference between the maximum value and the minimum value. The dispersion width is compared with a previously set determination threshold, for determining whether or not the dispersion width is greater than the determination threshold.

摘要翻译： 为了提供一种检测检查对象从调色板突出的方法，其能够进行高精度检测和减小插座断裂率，将检查对象引入到设置在 调色板，反过来被运输。 每个调色板用反射型光电传感器测量存储在多个凹穴中的每一个中的检查对象的反射水平。 从每个调色板的数据获得反射电平的最大值和最小值，用于计算由最大值和最小值之间的差定义的色散宽度。 将色散宽度与先前设置的确定阈值进行比较，以确定色散宽度是否大于确定阈值。

公开(公告)号：US5517036A

公开(公告)日：1996-05-14

申请号：US426473

申请日：1995-04-20

申请人： Shinji Semba ,  Shinji Enoshima ,  Kunio Kobayashi ,  Isamu Yamamoto

发明人： Shinji Semba ,  Shinji Enoshima ,  Kunio Kobayashi ,  Isamu Yamamoto

IPC分类号： G01R31/26 ,  G01R1/06 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L23/58 ,  H01L23/495

CPC分类号： G01R1/06 ,  G01R31/2886 ,  H01L2924/0002

摘要： A tape carrier includes an elongated electrically insulating tape divided into a plurality of separable tape sections. A semiconductor chip is mounted at each of a plurality of semiconductor device mounting portions having a plurality of leads on each of the tape sections. The semiconductor chips are connected to the respective leads. A plurality of testing connection terminals on each of the tape sections are connected to respective testing connection terminals by testing wires.

摘要翻译： 带载体包括被分成多个可分离带段的细长电绝缘带。 在每个带部分上具有多个引线的多个半导体器件安装部分中的每一个上安装半导体芯片。 半导体芯片连接到各个引线。 每个带部分上的多个测试连接端子通过测试线连接到相应的测试连接端子。

公开(公告)号：US07348191B2

公开(公告)日：2008-03-25

申请号：US11473081

申请日：2006-06-23

申请人： Kazunari Michii ,  Naoyuki Shinonaga ,  Shinji Semba

发明人： Kazunari Michii ,  Naoyuki Shinonaga ,  Shinji Semba

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of semiconductor chips is mounted on a surface of a substrate to be used for manufacturing semiconductor devices. The semiconductor chips are collectively sealed with resin, thereby forming resin-sealed sections. A plurality of solder balls are formed on the back surface of the substrate such that an interval A between the corresponding solder balls of adjacent semiconductor chips becomes “n” times (“n” is an integer greater than 1) an interval B between the solder balls on the semiconductor chip. After the semiconductor chips have been subjected to an electrical test, the resin-sealed sections and the substrate are sliced, thus breaking the semiconductor chips into pieces.

摘要翻译： 多个半导体芯片安装在用于制造半导体器件的基板的表面上。 半导体芯片被树脂共同密封，从而形成树脂密封部。 在基板的背面形成有多个焊球，使得相邻的半导体芯片的相应的焊锡球之间的间隔A成为“n”倍（“n”为大于1的整数）焊料间的间隔B 半导体芯片上的球。 在半导体芯片进行电气测试之后，将树脂密封部分和基板切片，从而将半导体芯片分解成块。

公开(公告)号：US5578919A

公开(公告)日：1996-11-26

申请号：US407381

申请日：1995-03-20

申请人： Shinji Semba ,  Shinji Enoshima ,  Kunio Kobayashi ,  Isamu Yamamoto

发明人： Shinji Semba ,  Shinji Enoshima ,  Kunio Kobayashi ,  Isamu Yamamoto

IPC分类号： G01R31/26 ,  G01R1/06 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66

CPC分类号： G01R1/06 ,  G01R31/2886 ,  H01L2924/0002

摘要： A tape carrier includes an elongated electrically insulating tape divided into a plurality of separable tape sections. A semiconductor chip is mounted at each of a plurality of semiconductor device mounting portions having a plurality of leads on each of the tape sections. The semiconductor chips are connected to the respective leads. A plurality of testing connection terminals on each of the tape sections are connected to respective testing connection terminals by testing wires.

摘要翻译： 带载体包括被分成多个可分离带段的细长电绝缘带。 在每个带部分上具有多个引线的多个半导体器件安装部分中的每一个上安装半导体芯片。 半导体芯片连接到各个引线。 每个带部分上的多个测试连接端子通过测试线连接到相应的测试连接端子。

公开(公告)号：US06836004B2

公开(公告)日：2004-12-28

申请号：US10342398

申请日：2003-01-15

申请人： Kazunari Michii ,  Naoyuki Shinonaga ,  Shinji Semba

发明人： Kazunari Michii ,  Naoyuki Shinonaga ,  Shinji Semba

IPC分类号： H01L23495

CPC分类号： H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame comprises a plurality of frame assemblies. Each framework assembly includes a framework, a suspension lead, a die pad, a plurality of inner leads and outer leads, a first tie bar and a second tie bar, and a lead support. The plurality of framework assemblies are disposed alongside of one another in a direction perpendicular to a direction in which the plurality of outer leads extend. A distance between close-set outer leads in each two neighboring frameworks is substantially n times a pitch of the plurality of outer leads in each framework, wherein n is an integer.

摘要翻译： 引线框架包括多个框架组件。 每个框架组件包括框架，悬挂引线，芯片焊盘，多个内引线和外引线，第一连接杆和第二连接杆以及引线支架。 多个框架组件沿垂直于多个外引线延伸的方向的方向彼此并排设置。 在每个框架中，每个两个相邻框架中紧密集合的外部引线之间的距离基本上是多个外部引线的间距的n倍，其中n是整数。

公开(公告)号：US6163145A

公开(公告)日：2000-12-19

申请号：US917922

申请日：1997-08-27

申请人： Hiromichi Yamada ,  Kunio Kobayashi ,  Sekio Ito ,  Eiri Yuhara ,  Shinji Semba ,  Jiro Takamura ,  Shinji Sogabe ,  Hiroyuki Shinmen ,  Mitsuru Yamazaki

发明人： Hiromichi Yamada ,  Kunio Kobayashi ,  Sekio Ito ,  Eiri Yuhara ,  Shinji Semba ,  Jiro Takamura ,  Shinji Sogabe ,  Hiroyuki Shinmen ,  Mitsuru Yamazaki

IPC分类号： G01R31/26 ,  G01R1/067 ,  G01R1/04 ,  B65G59/02 ,  G01R31/02

CPC分类号： G01R1/06705

摘要： A transporting apparatus used in testing a plurality of semiconductor devices includes a magazine in which a plurality of pallets are stacked in plural stages, each pallet with a plurality of semiconductor device placed thereon; a distributing stocker mechanism for placing the plurality of pallets in the magazine onto a carrier; a carrier transporting mechanism for transporting the carrier into a test station in a constant temperature room and transporting the carrier after to outside the constant temperature room; and a recovery stocker mechanism for recovering the plurality of pallets after test on the carrier into the magazine. Thus, the transporting apparatus with high installing area efficiency and high test efficiency can be fabricated at low production cost.

摘要翻译： 用于测试多个半导体器件的传送装置包括多个托盘以多个层叠的盒子，每个托盘上放置有多个半导体器件; 用于将所述多个托盘放置在所述盒中的分配储存器机构到载体上; 载体输送机构，用于将载体输送到恒温室内的试验台，并将载体运送到恒温室外; 以及回收储存器机构，用于在载体上测试之后将多个托盘回收到料盒中。 因此，可以以低生产成本制造具有高安装面积效率和高测试效率的输送装置。

公开(公告)号：US20060240596A1

公开(公告)日：2006-10-26

申请号：US11473081

申请日：2006-06-23

申请人： Kazunari Michii ,  Naoyuki Shinonaga ,  Shinji Semba

发明人： Kazunari Michii ,  Naoyuki Shinonaga ,  Shinji Semba

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of semiconductor chips is mounted on a surface of a substrate to be used for manufacturing semiconductor devices. The semiconductor chips are collectively sealed with resin, thereby forming resin-sealed sections. A plurality of solder balls are formed on the back surface of the substrate such that an interval A between the corresponding solder balls of adjacent semiconductor chips becomes “n” times (“n” is an integer greater than 1) an interval B between the solder balls on the semiconductor chip. After the semiconductor chips have been subjected to an electrical test, the resin-sealed sections and the substrate are sliced, thus breaking the semiconductor chips into pieces.

摘要翻译： 多个半导体芯片安装在用于制造半导体器件的基板的表面上。 半导体芯片被树脂共同密封，从而形成树脂密封部。 在基板的背面形成有多个焊球，使得相邻的半导体芯片的相应的焊锡球之间的间隔A成为“n”倍（“n”为大于1的整数）焊料间的间隔B 半导体芯片上的球。 在半导体芯片进行电气测试之后，将树脂密封部分和基板切片，从而将半导体芯片分解成块。