发明授权
US06836138B1 Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same
失效
具有用于促进球栅阵列封装测试的测试架构的模块，以及使用其的测试方法
- 专利标题： Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same
- 专利标题（中）： 具有用于促进球栅阵列封装测试的测试架构的模块，以及使用其的测试方法
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申请号： US10795507申请日： 2004-03-09
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公开(公告)号： US06836138B1公开(公告)日： 2004-12-28
- 发明人: Sung-Joo Park , Byung-Se So , Jung-Joon Lee
- 申请人： Sung-Joo Park , Byung-Se So , Jung-Joon Lee
- 优先权： KR10-2003-0040411 20030620
- 主分类号： G01R3126
- IPC分类号： G01R3126
摘要：
A ball grid array (BGA) package test module includes BGA packages, a module board, and test architecture for use in testing the BGA packages while they are mounted to the module board. The test architecture of the BGA package test module includes package test signal lines connected to solder balls of the BGA packages as extending along a bottom surface of the BGA packages, board test signal lines extending along the module board, and electrical junctions that interconnect the package and board test signal lines. Signals from the BGA packages can be picked up by the probe of a testing apparatus via the board test signal lines. The present invention is advantageous in that it minimizes the effect of stubbing by the test signal lines when the memory module is operating.
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