发明授权
- 专利标题： Integrated circuit comprising an auxiliary component, for example a passive component or a microelectromechanical system, placed above an electronic chip, and the corresponding fabrication process
- 专利标题（中）： 包括放置在电子芯片上方的辅助部件，例如无源部件或微机电系统的集成电路，以及相应的制造工艺
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申请号： US10308482申请日： 2002-12-03
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公开(公告)号： US06846690B2公开(公告)日： 2005-01-25
- 发明人: Alexis Farcy , Philippe Coronel , Pascal Ancey , Joaquin Torres
- 申请人： Alexis Farcy , Philippe Coronel , Pascal Ancey , Joaquin Torres
- 申请人地址： FR Montrouge
- 专利权人： STMicroelectronics S.A.
- 当前专利权人： STMicroelectronics S.A.
- 当前专利权人地址： FR Montrouge
- 代理机构： Fleit, Kain, Gibbons, Gutman, Bongini & Bianco P.L.
- 代理商 Lisa K. Jorgenson; Jose Gutman
- 优先权： FR0115594 20011203
- 主分类号： B81B7/00
- IPC分类号： B81B7/00 ; B81C3/00 ; H01L21/00 ; H01L21/30
摘要：
The fabrication of an integrated circuit includes a first phase of producing an electronic chip and a second phase of producing at least one auxiliary component placed above the chip and of producing a protective cover which covers the auxiliary component. The first phase of producing the chip is effected from a first semiconductor substrate and comprises the formation of a cavity lying in a chosen region of the chip and emerging at the upper surface of the chip. The second production phase includes the production of the auxiliary component from a second semiconductor substrate, separate from the first, and then the placement in the cavity of the auxiliary component supported by the second substrate and the mutual adhesion of the second substrate to the upper surface of the chip lying outside the cavity. The second substrate then also forms the protective cover.
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