发明授权
- 专利标题: Multibeam laser drilling apparatus
- 专利标题(中): 多波束激光钻孔设备
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申请号: US10740817申请日: 2003-12-22
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公开(公告)号: US06849824B2公开(公告)日: 2005-02-01
- 发明人: Kunio Arai , Kenji Suzuki
- 申请人: Kunio Arai , Kenji Suzuki
- 申请人地址: JP Ebina
- 专利权人: Hitachi Via Mechanics, Ltd.
- 当前专利权人: Hitachi Via Mechanics, Ltd.
- 当前专利权人地址: JP Ebina
- 代理机构: Crowell & Moring LLP
- 优先权: JP2002-377578 20021226; JP2003-149510 20030527
- 主分类号: G02B26/10
- IPC分类号: G02B26/10 ; B23K26/00 ; B23K26/04 ; B23K26/06 ; B23K26/067 ; B23K101/42 ; H05K3/00 ; B23K26/38
摘要:
Provided is a multi-beam laser drilling apparatus for drilling a workpiece, simultaneously at two positions while telecentric errors are suppressed, in which a conventional optical system in which galvanometer mirrors are used for a first laser beam, and a galvanometer-mirror system is located close to an fθ lens in order to prevent occurrence of telecentric error. A second laser beam which has been deflected by a second galvanometer-mirror system, transmits through a polarized beam mixers and is incident upon the first galvanometer-mirror system and the fθ lens, and accordingly, the workpiece is drilled simultaneously at two positions with the use of both first and second laser beams.
公开/授权文献
- US20040129685A1 Multibeam laser drilling apparatus 公开/授权日:2004-07-08
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