发明授权
- 专利标题： Semiconductor package with heat sink attached to substrate
- 专利标题（中）： 带散热片的半导体封装连接到基板上
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申请号： US10438463申请日： 2003-05-14
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公开(公告)号： US06849942B2公开(公告)日： 2005-02-01
- 发明人: Chang-Fu Lin , Han-Ping Pu , Cheng-Hsu Hsiao , Chien Ping Huang
- 申请人： Chang-Fu Lin , Han-Ping Pu , Cheng-Hsu Hsiao , Chien Ping Huang
- 申请人地址： TW
- 专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址： TW
- 代理机构： Edwards & Angell, LLP
- 代理商 Peter F. Corless; Steven M. Jensen
- 优先权： TW92105167A 20030311
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L23/34
摘要：
A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a flange in contact with the substrate, allowing a plurality of clip members to clamp the flange of the heat sink and the substrate. Each of the clip members has a recess portion for receiving the flange of the heat sink and the substrate to thereby firmly position the heat sink on the substrate. The clip members are engaged with edges of the heat sink and the substrate, thereby not affecting trace routability on the substrate. Moreover, the heat sink is mounted on the substrate and would not be dislocated.
公开/授权文献
- US20040178494A1 Semiconductor package with heat sink 公开/授权日：2004-09-16
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