发明授权
US06852152B2 Colloidal seed formulation for printed circuit board metallization
失效
用于印刷电路板金属化的胶体种子配方
- 专利标题： Colloidal seed formulation for printed circuit board metallization
- 专利标题（中）： 用于印刷电路板金属化的胶体种子配方
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申请号： US10253679申请日： 2002-09-24
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公开(公告)号： US06852152B2公开(公告)日： 2005-02-08
- 发明人: Raymond T. Galasco , Roy H. Magnuson , Voya R. Markovich , Thomas R. Miller , Anita Sargent , William E. Wilson
- 申请人： Raymond T. Galasco , Roy H. Magnuson , Voya R. Markovich , Thomas R. Miller , Anita Sargent , William E. Wilson
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser
- 代理商 William H. Steinberg
- 主分类号： C23C18/28
- IPC分类号： C23C18/28 ; H05K3/18 ; C23C18/30
摘要：
A colloidal metal seed formulation useful for catalytically activating a surface of a non-conductive dielectric substrate in an electroless plating process is provided. The colloidal metal seed formulation includes stannous chloride, palladium chloride, HCl and a surfactant selected from a diphenyloxide disulfonic acid or alkali or alkaline earth metal salt thereof, C30H50O10, an alcohol alkoxylate and mixtures thereof. A method of electroless plating of a conductive metal onto a non-conductive dielectric substrate using the colloidal metal seed formulation is also provided.