发明授权
- 专利标题： Semiconductor device having an improved mounting structure
- 专利标题（中）： 具有改进的安装结构的半导体器件
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申请号： US09665415申请日： 2000-09-20
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公开(公告)号： US06856028B1公开(公告)日： 2005-02-15
- 发明人: Kazuyuki Nakagawa , Michitaka Kimura , Masatoshi Yasunaga
- 申请人： Kazuyuki Nakagawa , Michitaka Kimura , Masatoshi Yasunaga
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2000-081026 20000322
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/60 ; H01L23/31 ; H01L23/495 ; H01L23/48 ; H01L23/28 ; H01L23/52 ; H01L29/40
摘要：
In a semiconductor device, a semiconductor element is bonded to an insulating circuit board. A resin layer for bonding the semiconductor element to the insulating circuit board is extended so as to become greater in size than the semiconductor element. Further, the surroundings of the semiconductor element are sealed with resin. Reliability of mounting is improved by alleviating stress developing in a solder joint of the external electrodes of the circuit board.
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