发明授权
- 专利标题: Plasma monitoring method and semiconductor production apparatus
- 专利标题(中): 等离子体监测方法和半导体生产设备
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申请号: US10139536申请日: 2002-05-06
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公开(公告)号: US06858446B2公开(公告)日: 2005-02-22
- 发明人: Atsushi Denda , Yoshinao Ito
- 申请人: Atsushi Denda , Yoshinao Ito
- 申请人地址: JP Tokyo
- 专利权人: Seiko Epson Corporation
- 当前专利权人: Seiko Epson Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Konrad Raynes & Victor, LLP
- 代理商 Alan S. Raynes
- 优先权: JP10-211834 19980710
- 主分类号: H05H1/46
- IPC分类号: H05H1/46 ; C23C14/54 ; C23C16/50 ; C23C16/507 ; C23C16/511 ; H01J37/32 ; H01L21/203 ; H01L21/205 ; H01L21/00 ; H05H1/00
摘要:
In certain embodiments a plasma is supplied from a plasma chamber 10 into a reaction chamber 18 of a plasma CVD apparatus. An electrode 22 is disposed in the reaction chamber 18. A semiconductor wafer on which a thin film is to be formed is placed on the electrode 22. A radio-frequency wave is generated by a radio-frequency wave generator 28 and supplied to the electrode 22 via a radio-frequency matching network 30, a blocking capacitor 32, and an RF probe 34 so as to control the plasma in the plasma chamber 10. A judgment device 38 is electrically connected to the RF probe 34. The voltage and current are be measured by the RF probe and the judgment device 38 is used to judge the state of the plasma in the plasma chamber 10.
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