发明授权
US06861158B2 Formation of silicon-germanium-on-insulator (SGOI) by an integral high temperature SIMOX-Ge interdiffusion anneal
失效
通过整体高温SIMOX-Ge相互扩散退火形成绝缘体上硅锗(SGOI)
- 专利标题: Formation of silicon-germanium-on-insulator (SGOI) by an integral high temperature SIMOX-Ge interdiffusion anneal
- 专利标题(中): 通过整体高温SIMOX-Ge相互扩散退火形成绝缘体上硅锗(SGOI)
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申请号: US10696601申请日: 2003-10-29
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公开(公告)号: US06861158B2公开(公告)日: 2005-03-01
- 发明人: Stephen W. Bedell , Joel P. de Souza , Keith E. Fogel , Devendra K. Sadana , Ghavam G. Shahidi
- 申请人: Stephen W. Bedell , Joel P. de Souza , Keith E. Fogel , Devendra K. Sadana , Ghavam G. Shahidi
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser
- 代理商 Robert M. Trepp, Esq.
- 主分类号: H01L27/08
- IPC分类号: H01L27/08 ; H01L21/02 ; H01L21/20 ; H01L21/265 ; H01L21/762 ; H01L27/12 ; B32B9/04
摘要:
A method of forming a substantially relaxed, high-quality SiGe-on-insulator substrate material using SIMOX and Ge interdiffusion is provided. The method includes first implanting ions into a Si-containing substrate to form an implanted-ion rich region in the Si-containing substrate. The implanted-ion rich region has a sufficient ion concentration such that during a subsequent anneal at high temperatures a barrier layer that is resistant to Ge diffusion is formed. Next, a Ge-containing layer is formed on a surface of the Si-containing substrate, and thereafter a heating step is performed at a temperature which permits formation of the barrier layer and interdiffusion of Ge thereby forming a substantially relaxed, single crystal SiGe layer atop the barrier layer.
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